The world?s second largest chipmaker and fifth largest semiconductor company will invest $1.8 billion in constructing the new facility in Cheongju, scheduled for completion sometime in 2019. Construction on the cleanroom and the shell (partitioned area around the cleanroom) will begin in August 2017, while the whole facility?s estimated completion date is in June 2018. The facility is expected to produce 3D NAND flash exclusively during its initial stages, and will later diversity into DRAM chip production as well.
The company originally set up its Cheongju factory in 2008 and has been using it for increasing NAND flash memory production for smartphones, SSDs and data centers. The company says its expansion plans are part of an effort to meet increasing demands for 3D NAND flash memory, in part due to the larger storage capacities of recent mobile devices.
Bookmarks