LSI PCIE ver. 3

[Tiltevros]

LSI Samples Industry’s First 6Gb/s SAS RAID-on-Chip IC for Next-Generation PCI Express 3.0 Server Platforms

LSI Samples Industry’s First 6Gb/s SAS RAID-on-Chip IC for Next-Generation PCI Express 3.0 Server Platforms
New dual-core ROC designed to deliver 600,000 I/Os per second, allowing users to take full advantage of solid-state drives; includes latest PCI Express® and SAS technologies
MILPITAS, Calif., December 16, 2009 – LSI Corporation (NYSE: LSI) today announced it is sampling the LSISAS2208 dual-core 6Gb/s SAS RAID-on-Chip (ROC) IC to OEM customers. The high-performance LSITM SAS ROC is intended to support the forthcoming PCI Express® 3.0 specification, currently under development within the PCI-SIG®, and provide I/O performance levels that meet the needs of next-generation server platforms based on PCI Express 3.0 and flash-based solid-state drive (SSD) storage.

The draft PCI Express 3.0 specification will extend PCI Express data rates up to 8.0 GigaTransfers per second per lane, doubling the host bandwidth that was achievable with previous generations. Integrating the latest enhancements in PCI Express and SAS technology, the third-generation LSI SAS ROC will deliver performance levels of up to 600,000 input-output operations per second (IOPS), allowing server platforms to take full advantage of the performance benefit of SSDs for applications such as Microsoft Exchange Server, databases, Web serving and business intelligence.

"Performance is becoming more critical in today’s enterprise environments, especially as more enterprise-class solid-state drives are deployed," said Jeff Janukowicz, Research Manager, Hard Disk Drive Components and Solid State Drives at IDC. "Devices such as the next-generation LSI ROC, coupled with PCI Express 3.0-based server platforms, are designed to maximize the performance benefits of flash storage."

The LSISAS2208 ROC integrates a 72-bit DDR3-1333 SDRAM interface, specialized hardware acceleration engines and a high-performance dual-core 800 MHz PowerPC processor for optimized RAID performance. In addition, the LSISAS2208 ROC incorporates enhancements such as single root I/O virtualization (SR-IOV) for greater performance in virtualized environments, improved system performance and data security, and more finely-tuned quality of service (QoS).

"From server generation to server generation, leading OEMs have relied on the LSI SAS portfolio to meet their storage demands," said Bill Wuertz, senior vice president and general manager, Storage Components Division, LSI. "As the industry now begins to look towards the PCI Express 3.0 wave of server platforms, the new LSISAS2208 ROC will enable OEMs to take advantage of the performance capabilities offered by the new specification, once again demonstrating LSI’s ability to help keep our customers at the forefront of industry inflection points."
"We are excited to see LSI implementing the latest PCI Express specifications in their next-generation products," said Al Yanes, PCI-SIG Chairman and President, commenting on the early adoption of the upcoming PCIe® 3.0 technology. "LSI has been an active member of the PCI-SIG since its inception participating in numerous technical working groups and developing products which include PCI Express technology."

Since the inception of SAS, LSI has delivered an industry-leading portfolio of products including controller ICs, expanders, host bus and MegaRAID® adapters, RAID-on-Motherboard (ROMB) solutions and storage systems. Based on a 25-year track record of hardware and firmware expertise and extensive validation processes, LSI is the silicon-to-systems supplier of choice for OEMs that want to deliver a broad set of storage solutions.



About LSI
LSI Corporation (NYSE: LSI) is a leading provider of innovative silicon, systems and software technologies that enable products which seamlessly bring people, information and digital content together. The company offers a broad portfolio of capabilities and services including custom and standard product ICs, adapters, systems and software that are trusted by the world’s best known brands to power leading solutions in the Storage and Networking markets. More information is available at www.lsi.com.


http://www.tweaktown.com/pressreleas...rms/index.html

[Anvil]

Exciting news Tiltevros,

PCI E 3.0, when is that about to emerge?

edit:
According to tomshardware http://www.tomshardware.com/news/PCI...elay,8515.html

dated: august 2009
"Originally, the specs were due to be released this year, with 3.0-enabled products to hit the shelves in 2010. Now, according to the new date, products compliant with the new specs won't be available until 2011."

[Tiltevros]

is allready to oems .
First RAID-on-Motherboard (ROMB) solution will be with PCIE 3

[Anvil]

Hmmm,

Intel Sandy Bridge will bring in native PCI Express 3.0

Sandy Bridge is Intel’s upcoming 32-nm chip architecture platform expected to go into production in Q4 2010. The new technology
is expected to replace the Nehalem and Westmere architectures. Now more and more rumors are coming out about the upcoming platform. Sandy Bridge will bring in native support for USB 3.0 SuperSpeed as well as PCI Express 3.0 which is the interface use for communication between the GPU and the other components. These new interfaces will be fully backwards compatible with existing systems.

[Tiltevros]

PCI Express 3.0 Specs Delayed
9:41 PM - August 21, 2009 ---------------> http://www.tomshardware.com/news/PCI...elay,8515.html



MILPITAS, Calif., December 16, 2009 – LSI Corporation (NYSE: LSI) today announced it is sampling the LSISAS2208 dual-core 6Gb/s SAS RAID-on-Chip (ROC) IC to OEM customers. The high-performance LSITM SAS ROC is intended to support the forthcoming PCI Express® 3.0 specification, currently under development within the PCI-SIG®, and provide I/O performance levels that meet the needs of next-generation server platforms based on PCI Express 3.0 and flash-based solid-state drive (SSD) storage.

http://www.lsi.com/news/product_news...009_12_16.html

The protocol is in first stage of testing thats why companies can make platforms based on PCI E 3.0

[Anvil]

OK

It time to start saving some money for the upgrade
Unfortunately, the 25nm Intel's will be available in Q4 from what I can remember. Ouch.