is the heatspreader soldered or not on this chip?
and is it whorth it to remove the Ihs? im running it under water..
/Tommie
is the heatspreader soldered or not on this chip?
and is it whorth it to remove the Ihs? im running it under water..
/Tommie
All phenoms I or II are soldered.
heatware chew*
I've got no strings to hold me down.
To make me fret, or make me frown.
I had strings but now I'm free.
There are no strings on me
okok.. is it worth the risk removing it, or is a simple "lapping"job good enough?
heatware chew*
I've got no strings to hold me down.
To make me fret, or make me frown.
I had strings but now I'm free.
There are no strings on me
the warranty issue is not concerning me, i just want to know if there will be a significant drop in temperature.. and if it is a big difference between a nicely lapped one, and cooling the die directly..
For normal water and air.....you won't see any major gains.......probably not worth the risk or effort.
We tried one delidded under ln2......it lasted 3 minutes , never posted again.
heatware chew*
I've got no strings to hold me down.
To make me fret, or make me frown.
I had strings but now I'm free.
There are no strings on me
Delidded with a torch or a gentler method? I remember seeing a Phenom I Agena that had the top popped off with a torch but it was already dead beforehand.
heatware chew*
I've got no strings to hold me down.
To make me fret, or make me frown.
I had strings but now I'm free.
There are no strings on me
Found this and it might be useful...
http://forums.extremeoverclocking.co...d.php?t=325952
I think lapping is better "less chance you can break it"
Coming Soon
i think i will try lapping it flat first.. the ihs is far from being flat.. very concave..
Lapping the heatspreader will gain you anything from 0 up till sometimes even 10ºC under load, idle won't see much of a difference.
Keep us posted, i'm curious how much of a difference either lapping or removing the hs will give.
Asus Crosshair V Formula-Z | FX 8350 | 2x4GB Trident-X 2600 C10 | 2x ATI HD5870 Crossfire | Enermax Revo 1050watt | OCZ Vertex 3 60GB | Samsung F1 1TB
Watercooling: XSPC Raystorm | EK 5870 Delrin fullcover | TFC X-changer 480 w/ 4x Gentle Typhoon | DDC2+ Delrin top | EK 200mm res | Primochill LRT 3/8 tubing
Case: Murdermodded TJ-07
sub 9 sec. SPi1M 940BE 955BE 965BE 1090T
The biggest issues with removing an IHS is not massivly overheating for long periods of time, and also, bending the PCB too much.
I first preheat the whole package to around 100c, then use a 'hot plate' that's around 200c. by applying gentle but constant "prying" pressure between hspreader and PCB, when the IHS itself conducts the heat to the solder joint, it will flow, and break free.. too much pressure though and the PCB might bend to a point it fractures solder joints on the capacitor networks.
This prevents the die from seeing excessive hea,t as when the solder melts, the cpu pops off, I quickly remove it from the area and let it cool naturally.
Remember, regardless of the fact the IHS older is relativly low melting point, the IC's can handle around 240+deg Celcius (~470 F) for a short time, as that's the temperature they would see if soldered onto a board. Not to mention the packaging process itself.
ihs removed would be nice a copper true sitting flat on bench board on some small case.
I think I dropped a few C lapping mine, not really sure though. My temp sensor might be broken. Added pressure to my TRUE mount and gained... nothing. Odd chip. On the other hand I gained 100mhz at the same voltage stock cooler lapping an AM2 3800+ X2 a few years ago. Here's a mid lap picture of my 940BE, as you can see they are quite concave.
and finished
Took about 2 hours started out dry sanding with 100 grit until it was all copper then smoothed it out with 600 grit wet.
Do you know what caused it to break?
Phenom II 940 BE / ASUS M4A79 / HD5770 Crossfire
3770mhz CPU 2600mhz NB | DDR1040 5-5-5-15 | 900/1250
okay, i have lapped the cpu now, and i did it with only 600Grit, cus thats the only one i had at home..
after running intelburntest a couple of times to let the AS5 have some time to "cure", i now see around 1-2 deegres lower temp.. thats ok, but not really what i expected.
have to admit im still very tempted at delidding this sucker..
Last edited by Tommie_lj; 09-13-2009 at 12:00 PM.
Perkam, sorry but i only have my K800i as a camera, and the cpu is already in the PC.. but i think i will try sanding it down to the silicone either today or tomorrow.. then i can take som pics for you guys
guess what... im sanding the little bastard right now!! i have a fair bit of sanding left, but i think im pretty close hehehe..
first to sand a Phenom II to te silicone?? ^^
When I lapped my 5000+ Brisbane I discovered it had a concave depression in the center shaped like an hourglass. Regardless, I didn't notice much improvement with my Vendetta 2.
Very nice Tommie...awaiting your temperature differences to be announced...
waiting for the as5 to get full effect, but somewhere around 5 degrees celsius cooler from stock IHS..
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