is the heatspreader soldered or not on this chip?
and is it whorth it to remove the Ihs? im running it under water..
/Tommie
is the heatspreader soldered or not on this chip?
and is it whorth it to remove the Ihs? im running it under water..
/Tommie
All phenoms I or II are soldered.
heatware chew*
I've got no strings to hold me down.
To make me fret, or make me frown.
I had strings but now I'm free.
There are no strings on me
okok.. is it worth the risk removing it, or is a simple "lapping"job good enough?
heatware chew*
I've got no strings to hold me down.
To make me fret, or make me frown.
I had strings but now I'm free.
There are no strings on me
the warranty issue is not concerning me, i just want to know if there will be a significant drop in temperature.. and if it is a big difference between a nicely lapped one, and cooling the die directly..
For normal water and air.....you won't see any major gains.......probably not worth the risk or effort.
We tried one delidded under ln2......it lasted 3 minutes , never posted again.
heatware chew*
I've got no strings to hold me down.
To make me fret, or make me frown.
I had strings but now I'm free.
There are no strings on me
Found this and it might be useful...
http://forums.extremeoverclocking.co...d.php?t=325952
I think lapping is better "less chance you can break it"
Coming Soon
i think i will try lapping it flat first.. the ihs is far from being flat.. very concave..
Lapping the heatspreader will gain you anything from 0 up till sometimes even 10ºC under load, idle won't see much of a difference.
Keep us posted, i'm curious how much of a difference either lapping or removing the hs will give.
Asus Crosshair V Formula-Z | FX 8350 | 2x4GB Trident-X 2600 C10 | 2x ATI HD5870 Crossfire | Enermax Revo 1050watt | OCZ Vertex 3 60GB | Samsung F1 1TB
Watercooling: XSPC Raystorm | EK 5870 Delrin fullcover | TFC X-changer 480 w/ 4x Gentle Typhoon | DDC2+ Delrin top | EK 200mm res | Primochill LRT 3/8 tubing
Case: Murdermodded TJ-07
sub 9 sec. SPi1M 940BE 955BE 965BE 1090T
ihs removed would be nice a copper true sitting flat on bench board on some small case.
The biggest issues with removing an IHS is not massivly overheating for long periods of time, and also, bending the PCB too much.
I first preheat the whole package to around 100c, then use a 'hot plate' that's around 200c. by applying gentle but constant "prying" pressure between hspreader and PCB, when the IHS itself conducts the heat to the solder joint, it will flow, and break free.. too much pressure though and the PCB might bend to a point it fractures solder joints on the capacitor networks.
This prevents the die from seeing excessive hea,t as when the solder melts, the cpu pops off, I quickly remove it from the area and let it cool naturally.
Remember, regardless of the fact the IHS older is relativly low melting point, the IC's can handle around 240+deg Celcius (~470 F) for a short time, as that's the temperature they would see if soldered onto a board. Not to mention the packaging process itself.
okay, i have lapped the cpu now, and i did it with only 600Grit, cus thats the only one i had at home..
after running intelburntest a couple of times to let the AS5 have some time to "cure", i now see around 1-2 deegres lower temp.. thats ok, but not really what i expected.
have to admit im still very tempted at delidding this sucker..
Last edited by Tommie_lj; 09-13-2009 at 12:00 PM.
Perkam, sorry but i only have my K800i as a camera, and the cpu is already in the PC.. but i think i will try sanding it down to the silicone either today or tomorrow.. then i can take som pics for you guys
guess what... im sanding the little bastard right now!! i have a fair bit of sanding left, but i think im pretty close hehehe..
first to sand a Phenom II to te silicone?? ^^
When I lapped my 5000+ Brisbane I discovered it had a concave depression in the center shaped like an hourglass. Regardless, I didn't notice much improvement with my Vendetta 2.
Very nice Tommie...awaiting your temperature differences to be announced...
waiting for the as5 to get full effect, but somewhere around 5 degrees celsius cooler from stock IHS..
I would have done that months ago if I had known it was possible without destroying the processor.
That difference is when idle or load ?
Nice work Tommie!
I noticed that my new 550BE (which unlocked) has a small rise in the middle, would lapping do me good with temps?
SweClockers.com
CPU: Phenom II X4 955BE
Clock: 4200MHz 1.4375v
Memory: Dominator GT 2x2GB 1600MHz 6-6-6-20 1.65v
Motherboard: ASUS Crosshair IV Formula
GPU: HD 5770
Felix, Load ofcourse the only temp that matters! :P
Smartidiot, maybe.. always best to have 100% flat cooler/cpu, or a very slight concave to give more pressure above the die..
my old Athlon X2 went down 5-7C Loaded when i lapped it..
do it waiting for pics of a naked cpu .. hehe
Bookmarks