GTX 260 55nm images (Uploaded on imageshack)

[Mk]

OK this what i got and re-uploaded them so they don't get removed

[Origin_Unknown]

certainly looks different

[Macadamia]

Wow, those RAM modules are packed densely.


OTOH first time seeing nVidia using a Blue PCB officially.

[Warboy]

Why is there more memory chips?

Wow, those RAM modules are packed densely.


OTOH first time seeing nVidia using a Blue PCB officially.

Look at BFG's Cards.

[Slovnaft]

cool beans

[Macadamia]

Why is there more memory chips?



Look at BFG's Cards.

Because there's nothing on the back, and they don't need to wrap the card up.

Those were easy, non-official cards on midrange GPUs.
I've never seen it done on a >384bit GPU.

[jasonelmore]

I'm glad they are taking the Ram off the back of the card.. Now we can get higher overclocks on the RAM. and not to mention that when you had these things in Tri SLI all that heat off of the back off the cards was just getting sucked into the other cards crammed in there with it.

[Sneil]

are these getting released before christmas?

[justageek95]

Original article here:

http://en.expreview.com/2008/12/05/f...ce-gtx260.html

[mascaras]

Zotac GeForce GTX 260² Pictured


NVIDIA will be releasing 55nm versions of the G200 graphics processor, which provides better thermal and power characteristics. What's more, NVIDIA could allow its partners to come up with their own designs or colour themes right away, at least from what can be seen with the Zotac GeForce GTX 260². The card uses a blue PCB, without a cooler shroud at the back of it. In the current iteration of the GeForce 200 series, memory chips are also located at the back of the card, requiring a heatspreader. In the newest iteration of the PCB, several changes are brought about:

• Toned-down power circuitry overall, with 4 phase vGPU and 2 phase vMem
• Aluminum support-brace surrounding the GPU
• Memory chips located only on one side of the PCB, leaving nothing at the back-side of the PCB that requires cooling, hence no heatspreader

The GPU is marked G200-103-B2 indicating it has been manufactured under the 55nm node. The card's cooler has been reportedly designed by Cooler Master, it is a monolithic surface with copper contacts over crucial components, with thermal pads. The GPU uses a fluid thermal compound to make contact with the cooler. Below are pictures showing the differences between the current GeForce GTX 200 PCB and the one that the new GTX 260 will sport, among other details. The card is expected to hit retail channels by January.



Expreview



http://forums.techpowerup.com/showpo...82&postcount=1

[clonez]

nice, but did the card have to be 3mm wider on the back side?
looks kinda wierd

and thats another price war,
get 'em back under 199€

[Richard Dower]

So will current 216 models fall in price then?

[jasonelmore]

From what I've read they are'nt going to have a new name with the 55nm refresh. You just might order you one in january and it show up as the new 55nm version.. I heard they were quitely going to drop them into resellers hands

[LiquidReactor]

Is this 55nm refresh going to have double the ram as well or is it just going to be higher clocked ram?

[Arkangyl]

Nice, so nVidia finally stopped calling each minor change a new generation.

Also I like the RAM (apparently) all being on the front side of the card, makes FC blocks easier to work with

[zlojack]

They're changing the layout?

Crap.

That means new waterblock designs...

[GAR]

I think im going to get 3 of these for 3 way SLi.

[Sly Fox]

I like the RAM. Don't have half your memory cooled by nothing but its own heatspreader.

If the PCB allows it and you got room, more power to NV!

[Origin_Unknown]

They're changing the layout?

Crap.

That means new waterblock designs...

does it? which set of holes do the waterblocks fix into now?

[zlojack]

does it? which set of holes do the waterblocks fix into now?

Not so much the hole layout, but the memory chips.

I use FC blocks.

[ericware]

awesome .. personally, I like a big vga card .. looks powerful though .. not a tiny card

[eric66]

new one looks as big as old one lol

[Zaskar]

Why is there more memory chips?



Look at BFG's Cards.

No ram on the back, so no need for a cooling plate on the other side.

[Origin_Unknown]

Not so much the hole layout, but the memory chips.

I use FC blocks.

ahhh oops! thought you ment just the core block!

[T_Flight]

I've been thinking they might do that with the RAM. If you look at the inside of EVGA's stock heatsinks they have twice the number of ram blocks in there and 1/2 of them were doing nothing. That might've been a good idea to do on the full cover waterblocks. This does present an issue with aftermarket cooling solutions. There may be alot of GPU blocks with RAM sinks again.

Dangit, I could order one of these to SLI and get one like this ona 280 and even the Unisink wouldn't work. I am getting a stadarnd non-fullcover block though. Might have to stepup and then go SLI later.

Watercooling these things does help them tremndously. They have alot of core and memory clock in them. I've found my max clocks already on the 280, but can't leave it there becasue of thermal runaway. I need more cooling. Watercooling these is really a great way to get solid max clocks from them.