I have considered fans. But I need to point out the keeping noise down is more important.
There is a rather large copper heatplate between the heatlanes on the heatsink and the hotside of the TEC. The plate is warmer then the heatsink by a noticable margin. Which to me suggests that thermalresistance between heatsink and TECs is far from optimal.
I knew this when I decided to include the hotplate. It comes with the heatsink. It made things a lot easier when coming up with a way to assemble everything. And the peltier is 40mm while the heatsink is about 60mm, which mean I would use only 2/3 of the small heatpipes in the heatlane without at heatplate in between.
Thermal resistance of heatsinks using passive convection goes down as they get warmer. I dont know if its obvious, but at constant airflow, energy flow between air and heatsink is in linear relation to temperature difference of the air and heatsink. But since the airflow increases with the higher temperature of the heatsink the C/W goes down. With this in mind I am still hoping to cool well without fans.
There are so many materials for the heat to transfer through in my setup:
CPU, thermalcompound, heatspreader, TC, Waterblock, water, waterblock, TC, peltier, TC, heatplate, TC, heatsink(which is complex as well, since it heatpipe-based), air.
Something about this is not optimal.
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