"Thermodynamics is a funny subject. The first time you go through it, you don't understand it at all. The second time you go through it, you think you understand it, except for one or two points. The third time you go through it, you know you don't understand it, but by that time you are so used to that subject, it doesn't bother you anymore".
Hows load holding when ya bench?
If you have a cooling question or concern feel free to contact me.
Any pics of ice and such on mobo? Would be great to see.
If you have a cooling question or concern feel free to contact me.
Hahhaa sorry Dave but It just doesn't pickup like F@H does at least for me. If you have four instances of F@H; one on each core; the pickup of heat is so quick at end of bench. It actually picks up at end of all benches and when its calculating score before score is shown.HEY! WCG.. and configurable for percentage of cpu load!
If you have a cooling question or concern feel free to contact me.
As for how it holds a load, you'll have to ask Scott but from what I gather it was doing fine at 5200+MHz. I'll be prepping one of my DQ6's for 3 stage benching this week, overkill insulation is in order.
Here is a better image. My camera is nice but it is still a point/shoot so focus is a pain sometimes.
Oh they've got plenty of capacity I'm sure. That thing can hold a cold evap sub -100C for quite a while without even the compressor on
If you have a cooling question or concern feel free to contact me.
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Come join us,get that warm fuzzy feeling that you've done something good for mankind.
General question: does anyone know of reasonably priced K type probe reader which can measure temps in a range of -200c and warmer? I cant find a replacement for my CEN-TECH 92242...
Back on topic...Im playing a bit of hooky from work today and working at home...hehe
Anyway in between emails I am messing with the NCE and added a thin layer of tin foil between the cpu and shims which has given me about 20 seconds longer before I hit my coldbug shutdown.
3DMark06 either wasnt stable at 5.3 ghz or I got too cold because it I froze on the first sequence and then shut down.
It takes me about 90 seconds under somewhat of a mild load to drop from -130 to -100 when I shut the 3rd off. How can I determine the pressures have stabilized and its safe to kick on the 3rd stage again? I might be able to run a heavy load bench and shut off the 3rd stage just before it completes so that I dont coldbug that way I can at least show a score of wprime.
In hind sight I really hate the fact that the mother board doesnt read temps and im flying in the dark
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Moderator's can we move this out of vendor relations?
All has been resolved and the unit is delivering well beyond my expectations.
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The UEI DT150 and DT200 are the cheapest K type readers that I know of. They aren't a fluke, that is for sure, but they'll get the job done.
Glad to hear the aluminum foil is working, maybe try two layers and progressively build up a stack? I'm hoping that you can detune the heat transfer between the evap and CPU enough to get the IHS to idle around -110C or so as it seems the chips were coldbugging when the evap was at -135 to -140 so I imagine the IHS was around -120C.
edit: with the pressure equalization if you could isolate the noise you could listen to the suction line. When you shut it down you should hear gurgling noise as the system equalizes through the capillary tubing.
I wonder if something like aluminum flashing or similar thin aluminum materials may work as well? For some reason, I don't like the idea of multiple layers. Once you reach a desired thickness, it seems that a solid piece of the appropriate material would be best. But, I certainly am not a "noob of leet" sub zero cooling guy, just the noob part.
Yes, Yellowbeard, a tall rough man with a big yellow beard
I'd say another thread with the results would be great and then close this thread with the last post linking to the new thread. That way it'll get more exposure and I imagine the phase change guys would like to see the fruits of all your labor.
The problem isn't the thickness but rather the heat transfer. He's got 1/4" copper blocks and the problem is he's only putting 2 "jumps" for the heat transfer to cross. I was hoping with the aluminum foil to add more of these jumps where the heat transfer is less efficient. Super tiny gaps are terrible conductors, even if there is thermal paste in between each sheet. With his 1/4" shims he was still coldbugging. It's nuts to say the least.
Never empower an idiot with a response....
http://en.wikipedia.org/wiki/Troll_%28Internet%29
Seller/Buyer Reputation:
Heatware: http://www.heatware.com/eval.php?id=50905
Ebay: {Family Account} Kasyg3 http://myworld.ebay.com/kasyg3/
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iTrader: http://www.blazingpc.com/forum/itrader.php?u=28
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