I decided to try lapping the NB on my Epox. I foolishly forgot to take photo's and I've put the dang passive HS back on there with the last drops of AS3. Regardless I can stiil take some as I haven't put the Epox back into my system yet. I have to run some memory tests on this IC7-G again. Onto the subject at hand.
I belive it was MajorSlaughter who suggested; ...lap the NB-HSF on the IC7-G, and he was abosolutely correct! Originally I couldn't do it because I didnt' have the paper, but I just did. It took almost an hour just to remove the residual glue left behind from the "foam-like" shim, placed to protect the NB-chip (which I feel only inhibits any airflow). The heatsink bottom is very coarse. The residual glue just fills what are surprisingly deep groves left from a rough sand job. I can see what he meant by the poor contact, which results in poor thermal transfer, raising temps, (and lowering memory performnace). There must be air-pockets trapped in there. And the pink TIM manufactures are using, seems to have a consistency of rubber. When a TIM has this much elasticity, it's integrity as a true TIM, is in question. I beleive there's a two-fold purpose manufacture's use this. This is about the tenth time I've removed this stuff from NB/HSF's, and it must double as a bonding material, which would exaplin it's rubber-like quality.
I then began to alp the NB, and using 600-grit, was ever so gentle. I removed the blue coating, onpon which the chip's ID is printed, until it was silver. The reason I posted this was to seek adivce from those more experienced with this. I've damaged NB chips before by accident, and know how easy it is to expose and damage trace wires. When attempting to remove the stubborn pink-TIM once I foolishly used a flat-head screwdriver. I thought i was being careful, but exposed the trace copper interconnect wires. Big mistake.
I havent put the Epox back in to see what differences there will be as I have to test this IC7-G, right now. I didn't lap the NB on this board because at this point it's technically not mine. But lapping the NB-HSF, obviosuly wil not harm the NB, but in fact increase the thermal transfer. I used the tiny amount of AS3 i had left. So I'm about to run some benchies. I'll have to take the Epox out of the box, and take some Pic's for ya. But as I said at this point, I removed the blue, and am down to aliminum. Can anyone tell me how far I can go safely? Is the NB core covered with a copper or aluminum casing?