Lapping the 2.4C IHS

[nailbomb]

No, I don't think that's the issue.

On the P4PE, i saw no drops in temp from jacking the Tornado from 7v to 12V, whereas on the DFI I do.

Also, on the DFI, it took more force to get the mounting clips secured. Hence, my belief that I"m getting better contact on the DFI. Its clamped down better.

[st0nedpenguin]

I suppose it could just be a slightly different height CPU socket on one of the boards then, or maybe the older CPU runs hotter anyway, some of the old P4's used to run pretty toasty.

I don't get any differenc in temps when cranking my Tornado up to full speed either, some people would be annoyed by that, me, I'm glad, if it performed better I might be tempted to run it at full speed, I doubt the neighbours would be happy.

[BioBlade]

should i remove the spreader first befor lapping it ?

[Liquid3D]

OMG NO Intel now uses epoxy between Core and IHS to provide better contact for thermal transfer. Trying to pry the IHS off will destroy the core. Remember lapping the IHS will void the warranty as well. So if your prescott is a Retail version, given the fact all motherboards currently available are merely ad hoc modifeid for Prescott's (that is only BIOS changes have been made allowing a lower Vre), there's simply too much risk the chip will be damaged. this would leave you with no recourse, and a loss of $185. Until motherboards have physical modifications made to their power circuitry, giving them true 478 Prescott support, there's an inherent danger to both mobo, and CPU. Warranties are going to very imporatnt to maintain until these changes have been effected.

EDIT: basically the last step in Riska's AMD64 guide below where he uses Arctic Silver epoxy to re-attach the IHS is what Intel is now doing to all chips. Of course Intel isn't doing such an excllent job. I also doubt they're using high quality epoxy (actually the best) such as Arctic Silver!

What concerns me, is mobo makers won't expend the capital needed to make these physical changes. That we 478 Prescott owners will be using motherboards with inadequate power supplies, which will eventually become damaged (check this out). I hope they won't leave thousands of Prescott owners with systems having a limited life. Tejas Prescott's will have the red carpet rolled out for them in the form of Socket 775 LGA (Line Grid Array) boards featruing Adlerwood/Grantsdale chipsets, DDR-II and PCI-Express (3GIO).

Even if you had a version without epoxy bonding IHS to core, it's a mirror finish and each I've tested (placing a razor blade edge along it's length) was perfectly flat. Lapping is to ensure both surfaces are as flat as possible, and as free of striations, and micro-pores as possible. Only when both surfaces (heatsink base and CPU) are perfectly smooth, and flat, can they mate together without any air pockets remaining.. That's the reason thermal paste is used, it becomes THE catalyst for thermal transfer, filling any grooves lapping may miss.

[Riska]

I have done this for my Amd 3400+ 64 cpu here is a guide but it is in danich but i have taken alot of pics!

http://www.burn-it.dk/index.php?stat...artikler_nr=38

[Liquid3D]

That is the most thorough heatspreader removal guide I've ever seen! Excellent work, and excllent photo's. May I place a link to it on my website mentioning you as the Author? www.ksbrainstorms.com

[nailbomb]

Keith,

I like you're new avatar.

I agree, the whole Prescott story seems a little fishy. I'm glad I got a 2.8c instead.

[ultron5]

I've done this /w my 2.4C too.







Got 25MHz more out of it (3-4 Deg)

[dioSRL]

thats a SL6Z3, it supposed to be glued.. How did you manage to remove it without breaking the core apart?

[ultron5]

yeah its a SL6Z3!

I removed the IHS with a small cutter and a razor-blade! I was afraid of killing the Chip but it survived.

[Riska]

Liquid3D
Sure put i op there!!

[fraguzz]

Is there any chance, it can work on a celeron 2,0 "NW"
the laping thing??
it looks like a p4 and basikly is....

[Liquid3D]

Any CPU with a heatspreader can, and perhaps should, be lapped. HOWEVER; prior to lapping, you should take a razorblade and lay it's edge across the center of your CPU to see if its' flat (and mating heatsink). Many CPU-heatspreaders are slightly convex in shape. Some are even concave, but most are not "perfectly" flat. IF your CPU's IHS center has a convex protrusion, lapping may acutally reduce it's cooling ability. This is especially true if the heatsink, or waterblock your mating it with is slightly concave in it's center (convex to convex would be better). You cannot determine flatness by laying the CPU or heatsink on a flat surface. If it's concave the edges will supoort it, and you'll never know. That's why using a razor blade, or some other simliar object is preferable. Your using the edge of the razor-blade and can place the dge on the CPU diagonally, or across it . etc.

Secondly; there's a difference here between "lapping" and removing the IHS. I don't suggest removing any Intel IHS manufactured after 10/2003. And all Prescott's and Extreme Editions.

Finally; with all due respect that CPU really doesn't look like a common Intel Northwood, it's retangular shape is very strange? Perhaps it's the angle of the photo, however; the retangular shape looks like it's accomodating the 2mb L3 cache of an Extreme Edition? Intel uses Shin-etsu and I've never seen it so "silver". It does look more like the Silver Epoxy used in the EE's? If so it might be one of the few succesful EE Intergrated Heat Spreader removals. Are you sure you don't have an EE there? when and where did you buy that chip ultron5?

See how square this 2.4C core is below;

[nailbomb]

Some are even concave, but most are not "perfectly" flat.

And in my case one side was concave, and the other was convex That's no lie either. I could tell by the way the copper was coming off. Also I draw an X across the HS with a Sharpie to see what's going on.

[Liquid3D]

I Definately beleive that's feasable, my friend, most definately.

By the way I haven't forgot about you, I'm still working on that and may have some good news. Don't ever feel shy about sending an email to remind me, if more then a week or so passes. Sometimes I get overwhelmed with stuff. hehe

[nailbomb]

No problem Keith, and if I get to feeling better I might give you call to BS for a bit. I
have had a nasty cold this week. Thought I was going to squeak thru this season without getting it too :p

[saaya]

ultron5 has an m0 stepping chip (gallatin core with defective or disabled L3 cache) thats wey its that much larger.

[ultron5]

Yes the chip is a gallatin with disabled L3 (are all m0 gallatins?)



I bought the Chip XMAS'03!

[fraguzz]

okey they dont look the same under the IHS but ontop!
i do not want to remove my IHS!!

2000@2800 (standard Volt)
my temps:
room temp: 23C
cputemp: 33C idle (load: 46C)
motherboard temp: 32C

thats with good airflow inside of case..
standard heatsink from intel (still same thermic tape)

----------------------------<

im thinking of lacping then use artic silver 5..
any idear what that would bring me? im stuck at 163mhz*20
my system:
soltek SL-85ERV
kingston pc2700 512mb

i ran the core at 1,664V
and the DDR at 1,78V
seems like its the ram thats setting me bag because at about 3000mhz i had to raise my ddr voltage to even boot! now at 3257mhz it can go fine (with enought cooling) but over that, no matter how higg i set my Core voltage it keeps §§§§ing up windows! blue screen... win2000

but my ram should take 166mhz right??