Humm.. so you removed the thermal pads
The mosfets heatsinks are covering 4 PWM each. This will cause in all cases a loose contact sometimes on some mosfets, despite the tightening of the push-pins. This is due to 4 things:
- The PWM surfaces are never even at a same level. Making that will need very expensive manufacturing process and is useless because of the bending of PCB. This first issue is the most important and impossible to correct, unless you lap evenly all mosfets with a glass
- The mb PCB is not hard, it bends, always... less than 1mm, but it bends
- Fixing of the heatsink is made by two push-pins on the extremities only, so impossible to solder to middle of the heatsink when the PCB bends
- Finally, ASUS heatsinks are really light aluminium without any surface polishing or special care.
It's not without a reason that all reliable third party manufactures of optional mosfets cooling kits recommand thermal pads for cooling mosfets.
This is also the case on VGA cards when cooling memory chips: you need either separate heatsinks per module, or the use of a thermal pad for many modules under the same heatsink because of the always uneven surface between two chips
Hope you understand better now what I meant
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