Got the EK full cover block installed last night and started overclocking. This was really the first attempt, i'm sure it could have done this with less voltage. The temps are phenomenal!
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Got the EK full cover block installed last night and started overclocking. This was really the first attempt, i'm sure it could have done this with less voltage. The temps are phenomenal!
Testing this soon... I also have Elpida memory on my 290x.
When I switched from Liquid Ultra to Pro, I saw an improvement of ~3 degrees
Well the 3226C840 3770K turned out to be marginally better than the 3226B988, it only needed 1.35V for 4.8GHz linx/prime stablility but still not nearly as good as my current 3213B472.
Nice! Now I am excited to try my chip!
Sold the 3226B988 (3770k) locally and just picked up a 3226C840 (3770k). Anyone have experience with this batch?
Well my 3226B988 turns out to be a dud compared to my current chip. This one needs 1.36V for 4.8GHz stable, my original chip only needs 1.308V for 4.8GHz stable. Time to ship it to the for sale...
Just picked up a 3770K 3226B988 to see if it does better than my current one. Couldn't resist Microcenter's price!
You can also set a lower cpu temp shutdown threshold in your bios.
Can you explain why the Raystorm didn't get recommended? It seems to perform very well (near the top) with only the mounting variation being a little high. I own one and I love it so I am probably a...
It looks like you removed/broke 2 capacitors (the larger smd) and 1 resistor (the smaller smd). If you have a multimeter you can measure the resistor on the opposite side of the CPU to get the value....
With 130% Power and a very mild overclock (+60 core, +100 mem, no additional vcore) my gtx680 with a heatkiller full cover maxes out at ~47C (22C ambient) after 15 minutes with furmark on the stress...
Gallium (which is a large part of the liquid metal products) reacts with aluminum which is why it damages certain HSFs. Gallium does not react with silicon or copper. Liquid metal products are...
I also used liquid ultra between the die and the IHS and experienced ~17C improvement across the board at 4.8ghz which seems higher than the average. You can't beat it for the interface between the...
Broken Pixel, it will be much easier/safer to use a thinner razor. Go to a drug store and get a double edged razor blade from the shaving section.
Liquid Ultra + Liquid Ultra would be best.
With that said, I am currently using Liquid Ultra + PK1 (with great results) because I like to change my waterblocks relatively frequently.
Wire size/gauge is based on max amperage and wire length. Wire insulation thickness is based on voltage. Every wire gauge calculator/chart uses amperage and cable length (resistance) to calculate the...
if USB 3.0 does something similar to POE (power over ethernet), then they can use multiple conductors (Power, Data+, Data-, SSRX+, SSRX-, SSTX+ and SSTX-) to carry the amperage. Its a very common...
Exactly this! I came here to say this also. Its a well known fact in the semiconductor industry.
I believe that if you are modest with your watercooling setup and optimize fan quantity and pumping...
I did not intend to offend. You are just the first case I have heard of the temps slowly getting worse after replacing the stock Intel TIM.
It sounds like you have poor contact between the IHS and the core because you did not scrape the black silicone/sealant off the perimeter of the chip and IHS. My temps have not changed since I first...
That is not true, most of the higher end TIMs will last at least a couple of years before "drying out". Also, Liquid pro/ultra will not dry out period.
Nice! Now you are getting almost the same temps as me with my exact same setup (liquid pro/ultra, pk1, and raystorm). I also found that the raystorm does not like direct die contact because of the...
I think you would find that the cost and benefit would not be worth the effort. The effort would be better spent modifying your current cooling solution to mate up with the die directly without...
You replace the TIM under the lid and put the lid back on. The socket retention mechanism holds down the lid so there is no reason to glue it. It is Intel's thermal paste that is the problem.
