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Following our news preceding, OCZ contacted us for us given more precise details on their new chips memories. In fact, this news memories DDR466 and 500 are based on "die" Winbond DDR500 which are packaged by using a packaging TSOP specific to OCZ, the EL GDR, which is finer and which thus offers a less thermal resistance. Now remain to know if these chips will be more powerful in practice than the future chips 4ns of Winbond, which will use for their part a traditional packaging.
Plus the fact OCZ mentioned they had moved to a 0.13-micron IC process and Winbond are producing these CH-5 that are also 0.13-micron based.