Finally managed a freaking 2400 Cas8 run with tWCL6 on some PSC (G.Skill Pi 2000C6).
http://i947.photobucket.com/albums/a...ps33b05205.png
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Finally managed a freaking 2400 Cas8 run with tWCL6 on some PSC (G.Skill Pi 2000C6).
http://i947.photobucket.com/albums/a...ps33b05205.png
Congrats! :)
hi everyone
I have a new memory kit from rma, it's samsung HCH9 ?
thanks for any help
http://i1306.photobucket.com/albums/...psbfa9d705.jpg
Seems to be dual sided, Samsung D most likely, HCH9. If it is single sided, these are most likely B, I cannot judge perfectly from view I have on the picture
@websmile yes, dual sided on this memory
i will try to test next week, after my processor back ;)
thanks for your help :)
does anyone know what IC would be in a gskill 2666 cl11 tridentX kit made may 2014? MFR?
I dont have serial numbers and this is all info the shop gives me..:(
Over at OCN, in the big memory thread, SamOCX says it's MFR now: http://www.overclock.net/t/1268061/o...#post_22662151
Any idea what Samsung some double sided, black PCB F3-2400C10D-8GZH with 13382500 SN could be?
Probably Samsung 2Gbit D-die, 1600MHz JEDEC bin.
Chance they use the same JDEC bin Corsair does on Dominator Platinum's? I assume not but out of curiosity, what does Corsair use? HYK0? HCH9?
Both actually. The JEDEC speed bin isn't really important, as long as it's Samsung 2Gbit D-die.
Have we figured out the SNs for DDR4? Looks like xxxx3400 is Hynix, but there also is xxxx3300 like with this kit.
I think most 2400C10 kits made G.Skill are made with Samsung 4Gb B-rev chips.
Thanks for the link!
3400 (= x40x) is Hynix, I've already added it to the first post in October. The review is already 2 months old, so it can only be Hynix or Micron, right? Since Hynix is already taken and so far there's no code for Micron, I guess x30x is Micron.
The first post has been updated with some info about the DDR4 kits.
I made some changes in the OP again.
These should for sure be PSC:
http://www.abload.de/img/1321256873fnun4.gif
https://abload.de/img/img_20180903_1837125173e0q.jpg
I believe the "0240" should be a typo, although if that did end up being Hynix I feel bad for "pissdrunx1987". They are the HardwareLuxx user who owns the kit.
The "41D" seems consistent, as I have seen another 2018 kit with the same last part of the serial. I believe it is Powerchip 1GBit Revision D.
https://www.ebay.com/itm/165015396234
What's interesting is that this kit was not a "PSC bin" at all, but it's likely that PSC D is all G.Skill had available.
DDR3-2400 CL8-11-11-30 @ 1.65V for sure is an odd bin for Hynix, but so far the codes have been very reliable (for future reference Ripjaws Z 11030240xxxxx).
Maybe 2Gb BFR can do it?
I've already added the "41D" for PSC in the first post.
Think that 2400c8 set might be from Fredyama originally, need to go check my bookmarks from my desktop. BFR or CFR maybe could do this bin, as could maybe a few other non-Hynix ICs, although I'm pretty sure this is just one of those weird mislabel type cases.
It might be interesting to try and replicate those specs on a kit of F3-19200CL9Q-16GBZHD (4GB DR DDR3-2400 CL9-11-10-28 @ 1.65V) and check if it can come close to DDR3-2400 CL8-11-11-30 @ 1.65+V.
The first post has been updated.
Update in first post.
what is this? 5600 hynix kit from gskill. not showing in CPUZ. Any ideas?
Hey mate, I can't open the attachment, it's giving me an error. Can you tell me the code written on the label?
Update in first post.
Both of these kits are Samsung 1GBit G-Die, the lesser known sibling of Samsung 2GBit D-Die. Telltale visuals are dual-rank PCB, Samsung code, and early 2013 date. Seems this IC is relatively uncommon outside of OEM modules.
https://cdn.discordapp.com/attachmen...0121074672.jpg
Binning strategy is very similar to Samsung 2GBt D-Die. Expect good sticks to need one higher tRP than tRCD. tRFC often does <90 for 2800mhz+. Will do one lower tWRRD as well. Most interesting, it does tRDRD 4! Dual-rank sticks on B63 will usually need a one-dimm-per-channel motherboard to do 1t at >2600mhz.