Intel 22nm 'Ivy Bridge' Core i7 3770K Reviews

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Originally Posted by ice_chill

Well if Ivybridge is 10% faster per clock, then a 4.5Ghz Ivy will match a 4.95Ghz Sandy :)

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The reviews that compared 4.8GHz Sandy vs 4.8GHz SB was showing a bit less than 10%, seems more like 5% on avg in that case.

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Originally Posted by BababooeyHTJ

Has anyone done any solid pci-e 3.0 vs 2.0 GTX680 sli benchmarks? I'll be honest thats what I'm really interested in seeing.

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here is tested 2600K PCIe 2.0 vs 3770K PCIe 3.0

http://www.motherboards.org/review/i...-core-i7-3770k

heres another

http://www.bjorn3d.com/articles/Inte...idge/2214.html

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Originally Posted by paulbagz

IB hit 85 degress on a 3x120 Rad?! =/

What fans were being used?

-PB

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The issue isn't temperature amount but rather heat concentration with this chip. There just isn't enough die space to distribute the heat.

One more:
http://www.lostcircuits.com/mambo//i...d=105&Itemid=1

I wonder if there will be a newer stepping to get the heat down.
Am abit dissapointed its looking like i may skip ivy bridge and just invest in a i7-3930K.

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Originally Posted by SKYMTL

The issue isn't temperature amount but rather heat concentration with this chip. There just isn't enough die space to distribute the heat.

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I see!

So nothing can be done too cool them down (even adding more rads)?

-PB

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Originally Posted by paulbagz

I see!

So nothing can be done too cool them down (even adding more rads)?

-PB

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shame we cant remove the ihs im sure that would drop temps a bit with the right waterblock

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Originally Posted by dasa

shame we cant remove the ihs im sure that would drop temps a bit with the right waterblock

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you can at your own risk

I wonder who will have CPU spacers out first???

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Originally Posted by SKYMTL

The issue isn't temperature amount but rather heat concentration with this chip. There just isn't enough die space to distribute the heat.

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Perhaps a return to the old Cather direct impingement water-block design combined with a IHS stripping?

ivy bridge might be the impetus necessary for someone to build a vapor chamber water block. you could modify a video card heatsink as the prototype. the ivy bridge chip is so small, the surface area needs to be increased as efficiently as possible. that means off with the heat spreader, off with the copper block, and on with a phase change!

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Originally Posted by EternityZX9

Question for those in the know since I'm going to be looking at getting an Ivy Bridge 3770K in a new build.

At an O/C of let's say 4.4 to 4.5Ghz on a 3770K prime 95 stable 24/7 on aftermarket air cooling:

1. What voltage should I expect to be using?

2. What temp can I expect idle/load?

3. Would you recommend DDR3 2400 RAM or something lower/higher?

Thanks for any insight!

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1. around 1.25v
2. 50-60/70-80
3. 2400 MHz is the sweet spot. Get the new TridentX. They are pretty nice.

An IHS stripping test would be much appreciated.

Go for it Marc !!

Any iGPU overclocking articles? :)

I was gonna say, all the reviews I was reading completely skipped the thermal part, lmao.

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Originally Posted by The Jesus

I was gonna say, all the reviews I was reading completely skipped the thermal part, lmao.

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Yes that is what made most of the reviews rather worthless in my opinion. There are some to have them, but we recently had the Bulldozer launch and there was no shortage of testing of thermals (or power) as their should be. Heat is an integral metric that many people use to compare products and need to know so that adequate cooling is supplied. I eventually did see some reviews with some thermal testing (why most who did overclocking wouldn't include it is beyond me - especially ananad who almost always include a comparison of thermals and overclocking on both aftermarket and supplied stock heatsinks).

I'm not saying there is a conspiracy, but it doesn't make sense why so many reviews lacked temp information. I'm considering getting an IB setup this summer as I want something with good power and I don't want to get something rather warm.

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Originally Posted by Hondacity

4x4gb 2400 :D

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Why not 2x8gb? Probably easier to overclock, and such TridentX sticks cost about the same.

I only hit the button once...

Since it double posted might as well add this:
http://hwbot.org/newsflash/1685_why_...d_22nm_process

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Maybe you know, Ivy Bridge are around the corner. Maybe you knows too, they are worst clocker then Sandy Bridge. We know why ...

As you know, Intel is with the 22nm production late. Production is not good, and there are big problems with the chips. The original "on paper" concept of 22nm chip with Tri-gate transistors is extremely low supply voltage. But, with current revisions Intel can not keep voltage in planned values. This is a problem. The chips have a higher voltage than planned, broadly comparable with Sandy Bridge. And that's wrong.

Tri-gate transistor needs to switch to a lower voltage. But for a correct recognition of the I/O status needs more current than planar transistor. Three-gate area is greater than one-gate and the current is several times higher than in Sandy Bridge chips. When Intel reach a planned low voltage, everything will be fine. Lower voltage means acceptable currents, less leakage and a great consumption. Unfortunately, it does not meet the current "E1" revision.

Current 22nm chips have high voltage, higher than they should have. The values are similar to Sandy Bridge chips. Properly should be the default voltage below 1V and it is not now. But Ivy Bridge needs a lower voltage, at the same voltage as Sandy Bridge consumption and temperature is significantly higher due to higher currents in the chip.

Basic Ivy Bridge idle voltage is above 1V, higher than Sandy Bridge. The load voltage is lower than that of Sandy Bridge and consumption is lower, but temperatures are higher. If the Ivy Bridge voltage increases, consumption and temperatures extremely jumps up. This problem can be solved only by improving the production, so maybe its time for another revision. Indeed it may be a potential problem in laptops with the highest third-generation Core i7 models.

In the desktop this problem occur with less overclocking than Sandy Bridge and significantly higher power consumption and temperatures. If you have a nice 5GHz + Sandy Bridge, keep it for now. Ivy Bridge ends with overclocking on the air somewhere around 4.6 to 4.7 GHz. But slightly lower overclocking then Sandies compensates higher performance per clock, so it is not a major problem.

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i doubt removing the IHS would have any benefit at all unless a direct impingement block was used, as mention earlier. The solder used to attach the IHS to the die has much better thermal conductivity than the thermal pastes that we use for our heatsinks. So by removing the IHS, which helps spread the heat out over a greater area helping our heatsink/waterblock extract that heat, you would probably see a rise in temperature.

From all the reviews the best(IMO) is the vr-zone's 4.8Ghz showdown between SB and IB:
http://vr-zone.com/articles/ivy-brid...own/15637.html
Nice tables with % difference in a lot of desktop workloads. Power numbers (when OCed) too.Very nicely done.

Their conclusion/summary is all one needs to know when it comes to IB:

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Originally Posted by vr zone

Recommendations / Lessons:

Clock for clock, Ivy Bridge (which is a "Tick" on Intel's roadmap) does offer performance improvements over Sandy Bridge, albeit mostly in single digit percentages. This is good news as the new processors will directly replace the old ones at roughly the same price points.
From the large pool of CPUs that we have tested/binned, Ivy Bridge uses 25% less power on average clock for clock due to the lower voltages required (in this case Sandy's 1.48v to Ivy's 1.27v).
Ivy Bridge's on-die temperatures (TJ Max of 105 degrees celsius) are a lot higher than Sandy Bridge, indicating possible high electrical leakage on the new process or a different measurement method. Note: Temperatures != Power, although there is some correlation.
Ivy Bridge is a (subzero) overclocker's wet dream, able to hit core frequencies near 7GHz with no cold bugs (unless motherboard induced).
In general, Z77 boards are better made and engineered (shorter electrical traces, better component placement) than their P67/Z68 predecessors, doing away with niggling BIOS firmware bugs and dodgy VRM implementations.
According to roadmaps, Ivy Bridge is the end of the road for Socket 1155 (next year's Intel "Haswell" CPUs will on Socket 1150), head for Socket 2011 if you need more than quad cores/16 PCIe lanes.
X79 is a better platform than Z77 if you need more than 16 PCIe lanes for 3-way/4-way GPU operation without the use of latency inducing switches.
If you already have a Sandy Bridge 2500K/2600K/2700K, stick with it as there is hardly any tangible reason to fork out US$212-$313 for a minor upgrade.


Read more: http://vr-zone.com/articles/ivy-brid...#ixzz1sxAnJT4x

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Originally Posted by R101

Any iGPU overclocking articles? :)

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Still in dutch, english article at the shrimps will be up tonite normally. But the graphs tell the tale

http://www.4tech.be/nl/review/intel-...i7-3770k?page=

3570K played nice up to 1600mhz with 0.15 voltage added; the 3770K was not stable over 1450mhz iGPU...

With extra system ram speed, the games scaled too... but still a long way to go for Intel to catch up with AMD APU

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Originally Posted by The Jesus

I was gonna say, all the reviews I was reading completely skipped the thermal part, lmao.

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Read ours. We dinged it no less than 10 times in our article, and with good reason.

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Originally Posted by Hoboclese

i doubt removing the IHS would have any benefit at all unless a direct impingement block was used, as mention earlier. The solder used to attach the IHS to the die has much better thermal conductivity than the thermal pastes that we use for our heatsinks. So by removing the IHS, which helps spread the heat out over a greater area helping our heatsink/waterblock extract that heat, you would probably see a rise in temperature.

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There is a big misconception that because the tim used between the ihs and the core (indium-gallium solder), it is what makes it an effective heatspreader. However, tim only serves to fill the gaps between the ihs (copper) and the core, where air will normally be to fill in the microscopic gaps/imperfections in the surface between the heatspreader and the core. The majority of the thermal conductivity is closer to 400W/mK. Replacing the ihs with the cooler directly will increase thermal performance, because the tim does not make up the majority of the contact. (or it shouldn't. If it is, you don't understand how tim works!)

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Originally Posted by informal

From all the reviews the best(IMO) is the vr-zone's 4.8Ghz showdown between SB and IB:
http://vr-zone.com/articles/ivy-brid...own/15637.html
Nice tables with % difference in a lot of desktop workloads. Power numbers (when OCed) too.Very nicely done.

Their conclusion/summary is all one needs to know when it comes to IB:

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i checked it out and i do not like the OC results for power consumption.
4.8ghz on SB should not take 1.48v
and then how did they get 4.8ghz on air with IB while the rest of the world seemed stuck at 4.5-4.6