Thermalright to launch Venomous X, new flagship heatsink

Source: http://www.fudzilla.com/

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Over the past few years, Thermalright has proven itself an unprecedented leader in high-performance cooling solutions for PC hardware consumers around the globe. With the outstanding achievements of quality manufacturing and engineering innovation on its side, the company continues to seek further improvement in its enthusiast lineup of air cooling products for the most demanding of overclocking circumstances.

As such, the company is in progress once again at improving its flagship Thermalright Ultra Extreme (TRUE) series heatsinks to the highest level that modern thermodynamic applications have the ability to overcome. During Computex 2009 back in June, the company unveiled a prototype of its upcoming successor to the Ultra 120-Extreme. The new performance crown carrier will be known as Venomous X, and it’s compatible with the full range of Intel socket LGA 775 / LGA 1156 / LGA 1366 processors as well as AMD socket AM2 / AM2+ processors. In terms of mass, the heatsink measures in at 132mm (D) x 63mm (W) x 160mm (H) and weighs 785g (1.73lbs) and is almost identical in dimensions compared to the Ultra 120-Extreme, which measures 132mm (D) x 63.44mm (W) x 160.5mm (H) and weighs 790g (1.74lbs).

http://www.fudzilla.com/images/stori...oming_soon.jpg
Our friends at Expreview were able to obtain several photographs of the prototype during Computex, which can be found here.

http://www.fudzilla.com/images/stori..._expreview.jpg
Thermalright has recently posted a mysterious image to its official site homepage, one suggesting that the Venom X flagship heatsink is “Coming Soon!” and should hopefully launch before the holidays arrive, according to our sources. We will definitely be keeping watch on this heatsink as it paves the way for a new era of thermodynamic competition in the heatsink manufacturing business sector.

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I'd like to see the test results! :D

a new era of thermodynamic competition?

heatsinks have had almost no change in the last few years. and this looks near identical and will only give maybe 1C better temps

According to NordicHardware, Thermalright has redesigned their Venomous X heatsink since Computex and there is no known information about what it will actually look like as of now. http://www.nordichardware.com/news,10377.html

It hardly looks any different or better than current CPU coolers.

it looks.. almost exactly like the Ultra 120- E xD

So it takes them more than half a year to put a True with holes on the fins on the market. No wonder I am still waiting for the case and the coolers they show on Computex 2008.

looks like the TRUE with more heat pipes?

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Originally Posted by Origin_Unknown

looks like the TRUE with more heat pipes?

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TRUE already has 6 heatpipes :D

The cooler in the picture looks exactly like an Ultra 120 Extreme to me...

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Originally Posted by BenchZowner

TRUE already has 6 heatpipes :D

The cooler in the picture looks exactly like an Ultra 120 Extreme to me...

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That second picture is probably not what it will look like. As NordicHardware stated, the Computex version of the Venomous X is not what the end product will be and that's the reason why it is taking them so long to launch it. They have revised the heatsink since Computex hence the delay. That is, if NordicHardware is correct. That teaser picture from Thermalright itself does look quite a bit like the TRUE though. We will just have to be patient.

If they manage to convince people this is a new flagship heatsink, that will be impressive for something that looks exactly the same.

This proves that heatsink is developed to its max.
We need new design ideas... that will fail miserably at first, but maybe lead to something...
Another 1-2C better results... that are 1-2C different if you remount the cooler.:rolleyes:

How many more successors to the Ultra 120-Extreme we'll see next?!

next up comes the TRUER: Thermal-Right Ultra ExtremeR, the difference is just the R, cause its more extreme, or is it?

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Originally Posted by XS Janus

This proves that heatsink is developed to its max.
We need new design ideas... that will fail miserably at first, but maybe lead to something...
Another 1-2C better results... that are 1-2C different if you remount the cooler.:rolleyes:

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Developed to the max? You can easily add surface area. So your statement is only true if the limiting factor is the ability to transfer the heat to that extra cooling surface. As long as adding airflow reduces temps, which has a similar effect as adding surface area while keeping airflow the same, the ability to transfer the heat to the cooling area is not the limiting factor.

From my limited point of view, it seems quite simple to improve the TRUE. It could easily get more surface area. Keep the design and give it a 14cm x 14cm body. We KNOW that 14cm fans move more air at the same rpm and noise.

I think the problem is that returns get smaller, while the cost for production rises. Take the Noctua DH14 that costs €80 over here. But making a 14cm TRUE or even bigger, will give better temps.

lets wait until we hear from a review site before we start ripping Thermalright (the top air heat sink manufacturer)

Looking forward to it. Course only time will tell how good it will actually be. I love my Thermalright heatsinks, and have used them for years with no regrets. Hope they pull through with a newer heatsink.

looks exactly like the true rev. c

look at this first review:
http://www.hardwareluxx.de/community...d.php?t=664210

for me its the same. but lets see what thermalright will release. :D

Meh the future is integrated WC like h50. We need an upgraded version of that instead.

Wonder if the only difference is the decent (flat!) base! :rofl:

We'll be screwed if every company follows the renaming, rebranding scheme like Nvidia. But hey it's a new trend right :ROTF:

:rolleyes:

opps.. ;)

^that dont look too bad at all. but its also not much better looking, like an extra 5% more surface area

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Originally Posted by iTravis

We'll be screwed if every company follows the renaming, rebranding scheme like Nvidia. But hey it's a new trend right :ROTF:

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what's funny is that as i was halfway through reading your post, i knew you were talking about nvidia. what a bad rep.

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Originally Posted by revogamer

:rolleyes:

opps.. ;)

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Wait, wait, wait..

That's the new cooler?

I'm more interested in what Prolimatech will come up with next, and for now, it appears the Noctua NH-D14 rules in air cooling. This one looks to resist what the engineers that left TR tried to get them to do yet again. The pipes are still staggered vs aligned, and the fin stack so tightly spaced now that between the two it will take a very loud, high CFM fan to push through it. Tight fin stacks are also a pain to clean.

Why not simply call it TRUE rev. D. The only chance they've got is if they used ultra hitech materials or some very special heatpipes. But knowing TR and how they like to rebrand every product without improving it this will probably be the same.

looking forward to it, hope the price is good.

thats it...? 1 more heatpipe???
does thermalright still have any engineers working in their labs or what? :P

is there anything else to do?

Since the TRUE has the same number of heatpipes but arranged differently they didn't go through so much trouble. What to expect from a company who's best engineers left and formed a new company.

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Originally Posted by jmke

is there anything else to do?

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no, all heatsink engineers should be fired and all heatsinks should be based on the TRUE from now on...

is there a need for a better air cooler? a decent one can keep a pretty beefy cpu cool with a very slow fan. and since theres no 250W TDP chips coming out for a desktop, whats the point of worrying about making a heatsink that can do very well, but fit in only a few cases, and only be sold to people who dont plan on WCing. it would probably be too expensive to design/make, and not sell enough of them since it would be a niche market.

i do believe air cooling is pretty much done until we see a new standard for socket designs that can offer something which brings a large jump in possibilities.

http://www.xtremesystems.org/forums/...1&d=1260330452
vs
http://www.fudzilla.com/images/stori..._expreview.jpg

i dnt think both r same :D
as u can see the top one has sharp cuts in the fins where as the bottom one shows smooth fins ...
i think either experview posted older pics :D or the other guy posted wrong images :)

Thermalright should rename it GTS 120 EXTREME

Too bad they didn't have the heatpipes come in direct contact with the core.

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Originally Posted by freeloader

Too bad they didn't have the heatpipes come in direct contact with the core.

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the top air HS don't have direct contact, it's not really the most efficient dispersion of heat, which is why you see Thermalright never doing it.

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Originally Posted by LedHed

the top air HS don't have direct contact, it's not really the most efficient dispersion of heat, which is why you see Thermalright never doing it.

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i think it has to do with pressure. since a heatpipe is probably too soft to get real contact, for direct touch blocks, the copper base acts like a frame and absorbs most of the pressure and dramatically reduces the surface area. so the heat limitation is now from the cpu getting to the base. while top end coolers have better heat pull from the cpu to the base, but slightly worse getting from the base to the pipes.

Here's some more to wet your appetite :D

i remember seeing that cyclone looking thing before, probably not that exact version though

i think they are too big for most applications. good idea. i just dont think we have the socket location ready for such things.

http://www.xtremesystems.org/forums/...1&d=1260386719

Wow...:eek:

If thats going to become the standard base finish for venemous / ultra120 revD thats going to be amazing.

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Originally Posted by saaya

no, all heatsink engineers should be fired and all heatsinks should be based on the TRUE from now on...

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yup, that was what I said.... :shrug: (and btw TRUE is based off another companies HSF; TR didn't do tower coolers for quite some time)


any way do you see a way to improve surface area, heat dissipation, while keeping in line with size and weight and price restrictions? we're running out of variations quite quickly; we've had the major HSF upgrades, none from the last 3-4 years have really stood out, major game changers so far:
- Going from alu to copper
- Adding Heatpipes to copper
- Tower coolers
.... all they've done now since the first tower coolers were introduced is add heatpipes and slightly tweak layout/fin size/amount. But a major step with current materials I'm not expecting. and with the size of the base being the decisive factor for adding heat pipes, you can only fit "so many" in that square... layered heatpipes don't have quite the same effect...

the only other semi-practical change is to go direct touch

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Originally Posted by DragoonXX

the only other semi-practical change is to go direct touch

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for big loads it isn't though, the base layer acts as a buffer for higher capacity.

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Originally Posted by LedHed

the top air HS don't have direct contact, it's not really the most efficient dispersion of heat, which is why you see Thermalright never doing it.

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I've seen the Hyper 212+ beat the TRUE and it uses direct contact. :shrug:

http://www.hardwarecanucks.com/forum...review-12.html

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Originally Posted by freeloader

I've seen the Hyper 212+ beat the TRUE and it uses direct contact. :shrug:

http://www.hardwarecanucks.com/forum...review-12.html

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one quick google and i found this
http://www.anandtech.com/casecooling...spx?i=3141&p=6

i would like to see a real test done to compare direct touch heatpipes with bases. id also like to see someone shave down the base of a true until the heaptpipes are exposed and see what happens (just for the fun and curiosity)

No direct heatpipe contact coolers as long as I have IHS off :D

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Originally Posted by Behemot

No direct heatpipe contact coolers as long as I have IHS off :D

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i ended up denting my waterblock doing that. and it wasnt a small dent, the entire area where the chip was ended up about 1-2mm pushed in. after hours of sanding i got most of it fixed. fixed my temps by about 15C

all cooper

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Originally Posted by jmke

any way do you see a way to improve surface area, heat dissipation, while keeping in line with size and weight and price restrictions?

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several things were mentioned in this thread already. direct touch of the heatpipes to the base, more, thinner heatpipes, vaporchamber at the base, improved fin profile, drum shape plus vga type fan... they dont even seem to TRY... nobody seems to...

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Originally Posted by saaya

several things were mentioned in this thread already.

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- direct touch of the heatpipes to the base: as pointed out, doesn't necessarily improve performance
- more, thinner heatpipes: thinner = less heat that can be removed per heatpipe
- vaporchamber at the base: expensive?
- improved fin profile: I think we've maxed out surface area with those
- drum shape plus vga type fan: classic fan offers superior performance/noise ratio;

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Originally Posted by saaya

they dont even seem to TRY... nobody seems to...

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- Xigmatek Thor has thin heatpipes & direct touch, amongst others
- plenty of custom size/design HSF with integrated fans, they fail horribly in performance/noise rank

:shrug:

im thinking the surface area can be better used. so much space where no air passes over, (like 30%?)

I don't know why so much negativity. If it ain't broke don't fix it they say. This is an evolution of the TRUE not a really new product. SO WHAT??? The TRUE is still highly competitive by itself and is the best heatsink of all times imo. They didn't have to change the shape much because it was almost perfect already. They addressed the base issues pretty much and added a bracket that is very innovative and should work very good.

So why are you people hating on it before a thorough performance review?
What if it turns out to be the best air cooler when it's released, what will you say then???

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Originally Posted by Katanai

I don't know why so much negativity. If it ain't broke don't fix it they say. This is an evolution of the TRUE not a really new product. SO WHAT??? The TRUE is still highly competitive by itself and is the best heatsink of all times imo. They didn't have to change the shape much because it was almost perfect already. They addressed the base issues pretty much and added a bracket that is very innovative and should work very good.

So why are you people hating on it before a thorough performance review?
What if it turns out to be the best air cooler when it's released, what will you say then???

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i will still say there are many advancements that can be made still. but i dont expect them all at once over a weekend. im still wondering what air cooling will be like a decade from now.

And oh yeah, like shown in the other thread, it actually looks like this:

http://www.nordichardware.se/image3.php?id=10438

the base:

http://www.nordichardware.se/image3.php?id=10439

and the bracket:

http://www.nordichardware.se/image3.php?id=10441

supposedly water cooling is going to become so cheap and easy to use that everyone will be on water eventually. Who knows how far away that is though and you know some will always use air, because water is not needed by todays PC. Maybe in the future the heat output will push the market into Water cooling.

I would be watercooling my builds if the cost was lower, or...more importantly, the integrated systems (corsair H50, LCLC..et all) could outperform decent air cooling...I personally can't justify buying a 70 dollar watercooling kit, only for it to be basically matched by a 40 dollar air cooler, and not having to worry about a potential pump failure

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Originally Posted by LedHed

supposedly water cooling is going to become so cheap and easy to use that everyone will be on water eventually. Who knows how far away that is though and you know some will always use air, because water is not needed by todays PC. Maybe in the future the heat output will push the market into Water cooling.

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heat output means power consumption. there will always be lower powered PCs, which are probably not built for overclocking. i personally would never buy a high end air cooler, since water cooling can offer the same benefit with silence, for a price, and at a cost of space.

im sure we will see some new interesting ideas, just no clue what though.

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Originally Posted by LedHed

supposedly water cooling is going to become so cheap and easy to use that everyone will be on water eventually. Who knows how far away that is though and you know some will always use air, because water is not needed by todays PC. Maybe in the future the heat output will push the market into Water cooling.

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The next time a computer friend tells you water cooling performs better or is quieter than air cooling, tell him his information is out of date. Air coolers have evolved to the point where a top $50 to $75 air cooler will normally outperform a water cooling kit at $300 or below. The best air coolers are much cheaper, easier to install, lower in noise, and provide better overclocking results than water cooling kits that are up to six times more expensive.
http://www.anandtech.com/casecooling...px?i=3097&p=10

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Originally Posted by Manicdan

i ended up denting my waterblock doing that. and it wasnt a small dent, the entire area where the chip was ended up about 1-2mm pushed in. after hours of sanding i got most of it fixed. fixed my temps by about 15C

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I mean I don't have IHS at all. I removed it, making direct contact heatpipe coolers useless for me. The core area is too small to be utilized by most of this coolers. But I learn something by that - removing is good only for big cores like Phenom X4 :yepp:

http://www.techreaction.net/2010/03/...-flx-review-3/

Just did a fan comparison on the Vex and turns out that even low pressure fans like the R4 work quite well.

This is more of a review for Noctua, but the graphs gives some idea of what I am talking about.

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Originally Posted by firas

The next time a computer friend tells you water cooling performs better or is quieter than air cooling, tell him his information is out of date. Air coolers have evolved to the point where a top $50 to $75 air cooler will normally outperform a water cooling kit at $300 or below. The best air coolers are much cheaper, easier to install, lower in noise, and provide better overclocking results than water cooling kits that are up to six times more expensive.
http://www.anandtech.com/casecooling...px?i=3097&p=10

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ROFL, no. Anything than uses a rad bigger than 120x1 with at least a semi-decent waterblock will blow air coolers away.

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Originally Posted by firas

The next time a computer friend tells you water cooling performs better or is quieter than air cooling, tell him his information is out of date. Air coolers have evolved to the point where a top $50 to $75 air cooler will normally outperform a water cooling kit at $300 or below. The best air coolers are much cheaper, easier to install, lower in noise, and provide better overclocking results than water cooling kits that are up to six times more expensive.
http://www.anandtech.com/casecooling...px?i=3097&p=10

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Please, dont talk if you don't know what you are talking about. For $240 you have this kit that will blow away any air cooling you can get your hands on by a loooooooooooooooooot of difference. And lets not talk about changing that dual rad for a 360 one as the difference would be even bigger. But hey, as it is you get more performance and less noise.

http://www.petrastechshop.com/swh2ulcpulic.html

It's funny that people refers to an article published nearly 3 years ago!

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Originally Posted by zalbard

ROFL, no. Anything than uses a rad bigger than 120x1 with at least a semi-decent waterblock will blow air coolers away.

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Exactly. The problem with LC is that you can make it as expensive as you want, which makes people believe that is actually uber expensive: its deffinitely not cheap, but if you don't go for tier 1 products it doesn't get that much expensive.