is the heatspreader soldered or not on this chip?
and is it whorth it to remove the Ihs? im running it under water..
/Tommie
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is the heatspreader soldered or not on this chip?
and is it whorth it to remove the Ihs? im running it under water..
/Tommie
All phenoms I or II are soldered.
okok.. is it worth the risk removing it, or is a simple "lapping"job good enough?
Up to you.....its your warranty.Quote:
Originally Posted by Tommie_lj
Can you kill it attempting removal? Yes.
the warranty issue is not concerning me, i just want to know if there will be a significant drop in temperature.. and if it is a big difference between a nicely lapped one, and cooling the die directly..
For normal water and air.....you won't see any major gains.......probably not worth the risk or effort.
We tried one delidded under ln2......it lasted 3 minutes , never posted again.
Delidded with a torch or a gentler method? I remember seeing a Phenom I Agena that had the top popped off with a torch but it was already dead beforehand.
It was done by AMD themselves.....Quote:
Originally Posted by DedEmbryonicCe1
Found this and it might be useful... :)
http://forums.extremeoverclocking.co...d.php?t=325952
I think lapping is better "less chance you can break it"
i think i will try lapping it flat first.. the ihs is far from being flat.. very concave..
Lapping the heatspreader will gain you anything from 0 up till sometimes even 10ºC under load, idle won't see much of a difference.
Keep us posted, i'm curious how much of a difference either lapping or removing the hs will give.
The biggest issues with removing an IHS is not massivly overheating for long periods of time, and also, bending the PCB too much.
I first preheat the whole package to around 100c, then use a 'hot plate' that's around 200c. by applying gentle but constant "prying" pressure between hspreader and PCB, when the IHS itself conducts the heat to the solder joint, it will flow, and break free.. too much pressure though and the PCB might bend to a point it fractures solder joints on the capacitor networks.
This prevents the die from seeing excessive hea,t as when the solder melts, the cpu pops off, I quickly remove it from the area and let it cool naturally.
Remember, regardless of the fact the IHS older is relativly low melting point, the IC's can handle around 240+deg Celcius (~470 F) for a short time, as that's the temperature they would see if soldered onto a board. Not to mention the packaging process itself.
i will post results later..Quote:
Originally Posted by Zeus
ihs removed would be nice a copper true sitting flat on bench board on some small case.
I think I dropped a few C lapping mine, not really sure though. My temp sensor might be broken. Added pressure to my TRUE mount and gained... nothing. Odd chip. On the other hand I gained 100mhz at the same voltage stock cooler lapping an AM2 3800+ X2 a few years ago. Here's a mid lap picture of my 940BE, as you can see they are quite concave.
http://img.photobucket.com/albums/v4...om2concave.jpg
and finished
http://img.photobucket.com/albums/v4...nom2lapped.jpg
Took about 2 hours started out dry sanding with 100 grit until it was all copper then smoothed it out with 600 grit wet.
Do you know what caused it to break?Quote:
Originally Posted by chew*
okay, i have lapped the cpu now, and i did it with only 600Grit, cus thats the only one i had at home..
after running intelburntest a couple of times to let the AS5 have some time to "cure", i now see around 1-2 deegres lower temp.. thats ok, but not really what i expected.
have to admit im still very tempted at delidding this sucker.. :bounces:
Holy Hell, if it isn't AFI 0_oQuote:
Originally Posted by afireinside
How're you doing m8? You must be in highschool/ college by now? :D
@Tommi, lapped CPU? WE NEED MOAR PICS !! :eek:
Perkam
Perkam, sorry but i only have my K800i as a camera, and the cpu is already in the PC.. but i think i will try sanding it down to the silicone either today or tomorrow.. then i can take som pics for you guys :)
LOL! Yeah I'm still floating around... Doing pretty good I'd say. second year of college now :shocked:Quote:
Originally Posted by perkam
guess what... im sanding the little bastard right now!! i have a fair bit of sanding left, but i think im pretty close :) hehehe..
first to sand a Phenom II to te silicone?? ^^
When I lapped my 5000+ Brisbane I discovered it had a concave depression in the center shaped like an hourglass. Regardless, I didn't notice much improvement with my Vendetta 2.
http://geting.se/image.php/193682-DSC01843.JPG
everything in this pic has its explaination :)
http://geting.se/image.php/193683-DSC01853.JPG
here is right after the top part and the solder has been removed..
http://geting.se/image.php/193684-DSC01857.JPG
dirty hand holding shiny chip :)
http://geting.se/image.php/193688-DSC01859.JPG
here he is in his home after a long long day :D:D:D
Very nice Tommie...awaiting your temperature differences to be announced...
waiting for the as5 to get full effect, but somewhere around 5 degrees celsius cooler from stock IHS..
That difference is when idle or load ?
Nice work Tommie!
I noticed that my new 550BE (which unlocked) has a small rise in the middle, would lapping do me good with temps?
Felix, Load ofcourse :) the only temp that matters! :P
Smartidiot, maybe.. always best to have 100% flat cooler/cpu, or a very slight concave to give more pressure above the die..
my old Athlon X2 went down 5-7C Loaded when i lapped it..
I would have done that months ago if I had known it was possible without destroying the processor.:clap:
do it ;) waiting for pics of a naked cpu .. hehe