Bulldozer Die Shot!

it's not a surprise that people do that. If you/AMD want prevent that, they need a better communication strategy.

Quote:

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Originally Posted by savantu

The whole problem started with GF 32nm process. GF and the IBM club use a gate first approach which is more problematic to control than the gate-last approach used by Intel. Gate-last requires more restrictive design rules, but if you can live with that, it is doable as Intel proved and offers similar performance if not better than gate-first.

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Again, that's basically investor board fud as usual.

Globalfoundries provides measurement data showing that "Gate first"
is working fine, with low Vt variation, low Idsat variation and is showing
healthy Weibull slopes under accelerated degradation tests comparable
to Poly-SION.

http://issuu.com/globalfoundries/doc...owFlipBtn=true


Regards, Hans

Quote:

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Originally Posted by Hans de Vries

Again, that's basically investor board fud as usual.

Globalfoundries provides measurement data showing that "Gate first"
is working fine, with low Vt variation, low Idsat variation and is showing
healthy Weibull slopes under accelerated degradation tests comparable
to Poly-SION.

http://issuu.com/globalfoundries/doc...owFlipBtn=true


Regards, Hans

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Of course, the prowess in powerpoint of the IBM FAB alliance is impressive.
Yeah, I'm still waiting since January 2007 for a HKMG process from the IBM alliance.

Quote:

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IBM and partners tip high-k, metal gates
Mark LaPedus
1/27/2007 12:27 AM EST
SAN JOSE, Calif. — IBM Corp. claims that it has developed the long-awaited improvements to transistor technology: high-k dielectrics and metal gates for use in logic chips.

Working with Advanced Micro Devices Inc. and its other development partners, Sony Corp. and Toshiba Corp., IBM has found a way to construct a critical part of the transistor with a new high-k/metal gate material, clearing a path toward chip circuitry that is smaller, faster and more power-efficient than previously possible.

The high-k and metal gate substitutes a new material into a critical portion of the transistor that controls its primary on/off switching function. The material provides superior electrical properties compared to its predecessor, enhancing the transistor's function while also allowing the size of the transistor to be shrunk beyond limits being reached today.

The technology can be incorporated into existing chip manufacturing lines with minimal changes to tooling and processes, making it economically viable.

IBM has inserted the technology into its state-of-the-art semiconductor manufacturing line in East Fishkill, N.Y. and will apply it to products with chip circuits as small as 45-nm starting in 2008.

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http://www.eetimes.com/electronics-n...-k-metal-gates

2 years and counting.....

Quote:

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Originally Posted by SEA

No arguments anymore and you started playing with words? :)
You are trying to assign new meaning for word "put".
After this you really should not take offense for Trollidamus... :rofl:
AMD created schedule for themselves where they put (=placed, not moved) different products in different order. Initially. They did not move the order.

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You are a bit confused. Reread 10 times what you wrote and what I did and maybe you'll see the light.