Originally Posted by bachus_anonym
By reading what Oscar Wu wrote and Angry Games' conclusions, you will see that what I said might be very true... Winbond-UTT is weak and might not be as good as an old BH-5, throughly tested by Winbond in high-heat/high voltage owens before it leaves the fab. Most memory module manufacturers test sticks manually using special testers but only fabs have owens that heat up ICs to 60-70C and apply high voltage to simulate months of "normal use".
Like Angry Games stated, 99% of truble cases come from users with UTT based sticks, which are NOT tested in a fab and as some may have a long, high voltage life, many others may not.
That was my last :2cents: on the subject ;)