Thats SUPER annoying :shakes:
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Some video on it
http://www.hexus.tv/show/2008/03/EVG...at_CeBIT_2008/
The zalman case has pretty much the same layout as the CM 690. Also, that Silverstone mid tower looks pretty nice. almost a cross between a Cooler Master case and a Gigabyte case. The motherboards seem to look more like toys or weapons every day :P
lol my director said to me today
"for your birthday we'll send you to CEBIT" the problem is my birthday is in july :(
I like the new cases, really loving that slim lian li.
Guys that Asus mobo is called after famous vine because it meant to be cooled by wine as a coolant :p: !
about that 256Gb solid state there was a rig like that setup at CES. they had crysis running on it and the level load time were unbelievable. the "Contact" mission loaded instantly. no load time......NONE. as in 0seconds. i was extremely impressed!
good job with the pics guys keep them coming!
Where's gallardo? :D
Stop quoting :banana::banana::banana::banana:ing pictures
If you reply to a post just before yours, theres no need to quote it anyway!
Are there any NF790 boards with ddr2 being shown or are they all ddr3?
hexus.net and cpu3d.con seem to be doing the most/best coverage for Cebit 2008 so far...
http://www.cpu3d.com/content/view/4196/25/1/5/
OCZ babes r the hottest so far
All images removed from quoted posts and replaced with links!
I've enough work to do guys :) Please avoid unnecessarily quoting images. Thanks!
Thermaltake's second backroom-surprise on its sprawling stand was a concept that landed late yesterday. The company was unsure whether to even show it at CeBIT 2008 but we're glad that it did. t's a refrigerated system that's still very much at the concept stage. But Thermaltake hopes to use its research to push niche solutions out into the mass market.
A simple condenser - with fan - is mounted where the chassis' rear fan would normally go. This connects to an expansion valve from where cooled liquid passes up to the CPU plate. The liquid moves on into a reduced-sized compressor before returning to the condenser to start the process again.
With copper running throughout the system, though, different configurations will be needed to suit differing motherboard layouts. And that appears to cause big problems for Thermaltake's plan to take this system into the mass market.
The company's trying to figure out how to get around that problem but, right now, even slight variations between motherboard layouts could undermine the whole idea.
First Post and guess what chipset it is
http://img.hexus.net/v2/internationa...WMCP7A-big.jpg
Source: http://www.hexus.net/content/item.php?item=12121
it is ENG SAMPLE :D