Btw there is no advantage of removing the heatsink cause Gskill has messed up the marking on ICs.
Printable View
You might need a small flashlight to spot these "dots"
Samsung 30nm
http://img62.imageshack.us/img62/529/ss30nm.jpg
Hynix CFR
http://img692.imageshack.us/img692/9754/cfrf.jpg
That would be a shame if the numbering system was discontinued, or modified in such a way as to invalidate what we currently know.
Just what did your PM say...that modules weren't responding as anticipated based on the numbering sequence, or were actual spreaders pulled & ICs confirmed to not be what was expected?
Thanks for the confirmation on the solder points and appreciate you looking into the "dots" question.
This is what I see on both sets of my BFR's, only two dots. And yes, I checked all four modules with a bright light, only the same two dots visible on all IC's :)
4 solder points on each side of the middle "dip" in the IC
http://img16.imageshack.us/img16/1940/bfr.png
Thank you for the info on the BFR chips...plus your post clarified what I misinterpreted earlier and that was that the 4 solder points were on each side (for a total of 8 viewable from the end for BFR and 6 for CFR, with 2 and 4 dots, respectively).
Of course now that I go back and read the post by theix again it clearly states on each side.
Here's an ass scratcher for you guys. :confused: WTF are these?
Answer is already there. All it takes is just a little peek under the heatspreader. :cool:
Samsung 30nm
http://img62.imageshack.us/img62/529/ss30nm.jpg
Hynix CFR
http://img692.imageshack.us/img692/9754/cfrf.jpg
I bet it's Hynix CFR.
Yea,same serial I also posted here a week ago:
http://www.xtremesystems.org/forums/...=1#post5097752
I have ntotal waste of time just like this kit.
I think its shady of Gskil to make us spend 200 bux on a kit and expect samsung and then get some high binned subpar ic. its all going back.
heres to you! all the time I wasted with this kit and the stupid video. Probably nothing compared to the time spent binning this horse crap ic. Im not blaming Gskill. but cmon 4 differnent ics for a product this early? its kida cheap of them. hand out samsung kits to all the reviewers and then give the guys that spent their hard earned cash on some totally different horse crap. yeah they do 2666 xmp profile but that is about it for me.
I can see swapping ics 4 months down the line but this was just released. this kit weeks away from the review samples and its totally different crap in the retail channels. There's one thing ive learned and im using my pi psc 1st run kit as an example. when crazy ram comes out. you better get your ass to the store and buy it asap/ after that its a total dice throw. i just didnt think it would happen this fast.
http://youtu.be/DgIdF-BofJc
H9C ......it's hynixQuote:
I have ntotal waste of time just like this kit.
I think its shady of Gskil to make us spend 200 bux on a kit and expect samsung and then get some high binned subpar ic. its all going back.
So conclusion is
H9C = Hynix => sucks cant go 2800
HCH9 = Samsung => rocks! 2800 is easy
Better grab the Samsung ICed Team Xtreem 2600C10 or 2400C9 than this TrolldentX
Actually I think your kit is built with Samsung ICs as well. It's single sided, isn't it? The 2Gb Samsung ICs seem to perform really great, but the 4Gb stuff doesn't. However, 1333MHz isn't so bad honestly.
Why do you say it's Hynix? Both "BFR" and "CFR" ( H5TQ2G83BFR and H5TQ2G83CFR ) are 2Gb ICs, what kind of magic trick is G.Skill using to build 4GB-modules with 8 chips? Of course it could be some other type of Hynix chip, but definitely not those.