Direct-die WCing! Cheap and easy.

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05-28-2009, 05:35 AM
Sadasius

I know it sucks to put time and effort into something to not get back expected results out of it. But you really do have balls of steel. Do they clang when you run? :ROTF: Good job and thanks for the test.
05-28-2009, 10:01 AM
rge

I third the above... not only did you have the balls to do a cool as hell experiment, but you also had the kohonies to post honest results afterwards despite being negative results :up::up::up:

I would definitely also like to see posted results of direct die with your fuzion if you do that next. At least there you will have a "heat spreader" via copper bottom of the waterblock, plus milled channels with more surface area inside waterblock. Again be interesting to see trade off of solder heat transfer to IHS before paste/waterblock versus directly to paste/waterblock.
05-28-2009, 10:07 AM
Hondacity

i just saw the results...man that was awesome! well the corei7 sure is hot thats for sure....but damn you stripped a xeon proc's ihs ...thats fearless :banana::banana::banana::banana:t :D
05-28-2009, 10:14 AM
WaterFlex

Pitty :(
05-28-2009, 11:28 AM
silverphoenix

I wonder as a thought, to salvage it, how about artic ceramique gluing some copper BGA sinks to the IHS.
05-28-2009, 11:54 AM
alacheesu

Awesome project, IMO, even if it didn't turn out as well as you hoped.
05-28-2009, 12:30 PM
p2501

:up: for this experiment man! :yepp:

Reading the quote of Cathars post I can't get the thought of 4 RD30 hammering water on that die in parallel with an 4 (3/4") to 1 (1/2") manifold. :slobber:
05-28-2009, 12:51 PM
tuanster1119

Great experiment. Kudos for having the balls to do this... I know mine aren't strong enough.
05-28-2009, 01:22 PM
ctsoccer13

Would it have been possible to have mounted something to the die to increase surface area and, potentially, spread the heat?

I know what you're thinking, no, not like an IHS. Something that the water could flow on, under, and all around to improve heat transfer beyond using the IHS.
05-28-2009, 04:31 PM
HotGore

Quote:

Originally Posted by p2501

:up: for this experiment man! :yepp:

Reading the quote of Cathars post I can't get the thought of 4 RD30 hammering water on that die in parallel with an 4 (3/4") to 1 (1/2") manifold. :slobber:

Someone needs to do that!! :bravo:
05-28-2009, 04:39 PM
crio

All i can say is "That is wack"...
05-28-2009, 05:21 PM
BringerOdeath

Hey sure the temps weren't good, but it's still a success since the chip still worked and your not down $270 on a 920!:D Not all experiments are a success, hence why it's called and "experiment" and not a "sure thing"!;)
05-28-2009, 05:23 PM
Sadasius

Quote:

Originally Posted by BringerOdeath

hence why it's called and "experiment" and not a "sure thing"!;)

Doh....Have to edit my bet's as an experiment. :rofl:
05-28-2009, 08:09 PM
fallwind

Thanks guys! Attaching something to the die like a RAM sink has it's merits. I'm going to think on this experiment a while and may get back to it one day.

I tried mounting my Fuzion to the bare die but the 1366 socket is so big that the waterblock doesn't supply enough down force to make the CPU get good contact with the socket pins. I don't have a backplate on my board and my top plate is kinda flimsy so I didn't want to force it. I needed my rig back up and running so I just swapped my old chip back in for now.
05-28-2009, 09:28 PM
s0lid

Wallwind, please note that the otherguy who did this same had waterchller in use which cooled water to 20c :)
05-28-2009, 09:44 PM
eligray

I honestly think this would work VERY well if the channel was restricted so that high velocity water would jet across the CPU surface.

Thanks for trying something new!
05-28-2009, 10:21 PM
santiagodraco

Quote:

Originally Posted by fallwind

Thanks guys! Attaching something to the die like a RAM sink has it's merits. I'm going to think on this experiment a while and may get back to it one day.

I tried mounting my Fuzion to the bare die but the 1366 socket is so big that the waterblock doesn't supply enough down force to make the CPU get good contact with the socket pins. I don't have a backplate on my board and my top plate is kinda flimsy so I didn't want to force it. I needed my rig back up and running so I just swapped my old chip back in for now.

I think that is the problem. It seems (and this is totally uneducated guessing on my part) is that the problem is a combination of flow and surface area. Basically you need more water hitting more area to dissipate more heat.
05-28-2009, 11:05 PM
hellcamino

fallwind it was a good try and with a more powerful pump(s) it would have had better results.

btw, I like my crow with a little garlic.
05-29-2009, 02:06 AM
Movieman

Quote:

Originally Posted by ecat

Disappoint ?

In spite of the controversy you stuck to your guns, went through with the test and posted the results. Excellent work :) Be sure to update this thread with your Fuzion on die results :yepp:

No cores were harmed in the making of this thread.

QFT! Fallwind, you and we all leanred from this and for that you have my thanks.
Like Edison said, he didn't learn one way to make a light bulb, he learned 2000 ways not to make one.;)
05-29-2009, 12:55 PM
Nightstar

I'm certainly not disappointed. Mad props for seeing it through.

I was hoping you got better temps though. Seems the closed block will work better for you after all. :shrug:

This is the sort of Xtreme LC experiment I come here to read about. Anyone can bolt up some store bought parts, it takes courage and imagination to attempt something extraordinary.

If you're not ready to give up just yet, jamb a tube that sits just short of the die into the inflow barb and retest it.

BTW, what is that oh so shiny pump you're using?
05-29-2009, 03:07 PM
YukonTrooper

Maybe it's because there's a dead-spot of low flow right over the surface of the die, allowing for excess heat to build up in liquid that's taking a long period of time to exit the block.

http://img291.imageshack.us/img291/9585/deadspot.png
05-29-2009, 06:43 PM
eligray

Quote:

Originally Posted by YukonTrooper

Maybe it's because there's a dead-spot of low flow right over the surface of the die, allowing for excess heat to build up in liquid that's taking a long period of time to exit the block.
[/IMG]

Quote:

Originally Posted by eligray

I honestly think this would work VERY well if the channel was restricted so that high velocity water would jet across the CPU surface.

:up:

If you can get velocity across block a lot higher (which you definitely can by using a narrow jetlike channel), you will see big improvements :D
05-29-2009, 07:58 PM
Utnorris

Awesome experiment and definitely BALLS OF STEEL. Keep the faith and keep up the great work.
05-29-2009, 09:12 PM
paul_

Quote:

Originally Posted by YukonTrooper

Maybe it's because there's a dead-spot of low flow right over the surface of the die, allowing for excess heat to build up in liquid that's taking a long period of time to exit the block.

http://img291.imageshack.us/img291/9585/deadspot.png

He said there was a turned-around barb in there jetting water onto the die about 1/8-1/16" away from it. Back on page 2 or 3 I think
05-29-2009, 09:32 PM
YukonTrooper

Quote:

Originally Posted by paul_

He said there was a turned-around barb in there jetting water onto the die about 1/8-1/16" away from it. Back on page 2 or 3 I think

:rotf: :doh:

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