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It's also difficult for me to believe my temps are holding me back, which are topping 55-60c, when i see people here topping 70-80c regularly, and 90c+ without fatal issues.
It´s important to note that i have spoken of thermal issues only in relation to use of a very strong test as Linpack. My cpu and mobo temperatures are good, even by air. But, as i´m experiencing, the key is the union of heat stress plus electrical stress. I think that is not important 10 degrees at 3.8Ghz, 180 bclk, full load Prime, but maybe only 3 degrees at 4.0Ghz, 211 bclk (my settings), full load Linpack. Comes to my mind the word "electric fatigue" or, better, "PCB fatigue".
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Compared to prime, pretty much everyone, on the posts i was reading, on this forum and others. If you google you'll find many posts stating between 5 and 20 runs as commonly used to verify complete stability. Like i said yesterday (or the day before maybe) the reason i switched to it was because prime started causing crashes after huge periods of time, and i was after a quicker way to test. Linpack was a much quicker way to test, by popular opinion anyway. If i'm going to have to run even that for 6-8hr+ to get reliable results, i'll stick to what i know (prime) :up:
The key is that with Linpack we can achieve very quickly (generally) a system full Prime95 stable. But is not so fast to reach a system Linpack stable (although this is faster than achieving a stable prime95 system using only prime95). The problem is compounded if Linpack from a certain OC level begins to introduce abnormal errors due to its enormous and abnormal power.