wow i missing that news!!! 2011 mean new Waterblock&Heatsink too!!!
Printable View
I have heard that the 2011 will use the same spacing for heatsink, etc as the 1366. not sure on the accuracy of that though.
now, waiting at first benchmark (crazy Cinebench R10 and R11.5, it will be score !!)
Cant wait for some more info to be leaked!
looking at the pin spacing, it looks like the 2011 socket will be much larger than 1366 and will probably have diferent heatsink spacing. we will know for sure in the coming months, i do hope the release schedule for 2011 gets advanced, i need to retire my 775 setup...
definately new heatsink spacing...
hey JC, if you can, it would be very useful for the watercooling and ln2 guys here if you could post the 2011 mounting hole spacing :toast:
Really nice :D
Thanks a lot JC :up:
nice, thx for the pics. :D
So 2,5mb L3 per core confirmed. Also interesting to see that the L1I is now 8 way associative instead of 4 way. Higher association für L3 was kinda expected for the bigger size.
btw. JC if you having fun with the system, could you run this little bench?
http://www.cpuid.com/medias/files/softwares/latency.zip
Im curious about the L3 latencies... :D
seems to be a 3.2GHz CPU
unless it's a 4.2GHz CPU :D
16 threads! :eek:
Why put IGP/GPU on die on this kind of processor ? That's waste IMHO :shrug:
hehe i told you all this way back in March :D Nice update tough JC. Will try and get my self one of these and try some benchs or something.
BTW JC sent you a PM awaiting a reply...
taken from -> http://www.xtremesystems.org/forums/...d.php?t=246743
Not at all this saves the mobo maker some money not only that it gives Intel more fiscal return. Not to mention that this is the future "Fusion is future hehe"
omg !!! 20 MB L3...this is real :banana::banana::banana::banana: :D. thx JC and we are all still waiting for next update :)