VR-Zone Speculation on Steamroller
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At up to 5 dual-core pairs per die, only two channels of DDR3 memory might not feed the CPU as well as four channels of DDR3-1866 (possibly even 2133, looking at Inphi's register clock chip announcement this summer for such ECC buffered DIMM support) on the Ivy Bridge EP next year. The effects on memory bound apps including the increasingly popular 'big data' and analytics, would be serious.
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Combining AMD eDRAM and backside L4 cache die approach could give AMD a, say, 128 MB or even 256 MB dedicated L4 cache sitting on a wide, even 1024 bit, bus within the chip packaging, and massively help counter the bandwidth drawback of the two DDR channels per die. In some apps where the code and/or big loops of data fit within that footprint, you could get over double the real life performance just this way.
2014 is far but if AMD is staying in the same socket then they will have to get creative to achieve substantial performance gain.
source: http://vr-zone.com/articles/how-amd-...013/17105.html