Wouldn't removing the IHS significantly improve your thermal conductivity possibilities? Has it been done with good results? Or is it just too risky...
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Wouldn't removing the IHS significantly improve your thermal conductivity possibilities? Has it been done with good results? Or is it just too risky...
Yes, especialy with the E21XX series since they use tim between the sillicon and IHS on those. Not solder like the more expensive C2d.
It Is risky. I wouldnt do it on a more expensive cpu. You dont gain that much.
I have a e8400 now and Im not even going to lap this one because I wanna keep my warranty a couple of months more.. Never know what could happen with with the new 45:s. The sure have an issue with the temp sensors on these. :mad:
I lapped a 1.4Ghz P4 a few days ago... lol. 2ºC idle temp drop!
That was the crappyiest lap ever, it took about 2 mins.
http://img394.imageshack.us/img394/4347/templm9.jpg
Am I supposed to lap my IHS? As you can see, the gap between both core temps are a lil high.
So whats the best finish for me using AS5?
A friend sends me a Q6600 with IHS off:
http://images4.hiboox.com/vignettes/...ec2b2d9daf.jpg
For fun on my watercooled rig, with a 1.60v Vcore, 8x450:
idle: 30°
full: 46°
Water: 27°
Ambiant temp': 25°
:p: gains are here :D
So you saying if i lapped my IHS even though it is flat i checked it .... i would get 4-5C more off of load temps and maybe 2-5C on idle?
My load temps under folding = 63-65C max on core 0 and the rest are 60-56-58 MAX
my e8600 had no contact in the middle.
so I lapped it.
its a void of warranty and it lowers temps somewhat.
gains can be good depending on cooling system.