right method to burn in TCCD ram

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Originally Posted by varzmaster

I took the heatspreaders of my v1.4, v1.5 and v1.7 and they're all rebranded Winbond BH-x UTTs (says Corsair on the ICs... but they've got the two classic Winbond dimples on them and respond pretty good to any voltage above 2.8V). Of course... it depends on the lot#... but as I've said before... all v1.x are Winbonds. ;)

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if this is the case, possibility i get winbond ram is high, but how do u explain i can get low voltage at high fsb? etc ddr600

i dare to open the heatspreader, void warranty :D

It's not necessary to remove the heatspreaders (aka voiding warranty :D)... just read the rev on the label carefuly. ;) If it's 4.1, they're TCCD's. If they're 1.4, they're UTTs. That simple.

It is possible that for the 4.1 rev, Corsair may have used other Samsung ICs (like TCC5)... which may be a good thing. I got DDR606 2.5-4-3-8 1T on A64 (Abit AN8) and DDR566 (283 MHz) 2.5-3-3-5 (with PAT) on Intel (Abit IC7). Those TCC5s are used in rev 4.3 of the Corsair 3200C2(PT). :)

You make me laugh :D Are those memtest screens supposed to show some kind of stability? I hope that TCC5 can do much more than that. :stick:

Well... they are supposed to do just that. But I think that's beyond you. :rolleyes:

Now seriously. Are those settings Superpi32M stable? I've wrote that because 2 memtest #5 loops proves nothing. I had one Plat rev2 stick faulty, which can't do 2-2-2-5@200. It gave errors only at the 20th-30th loop of test5. Nonetheless, using win XP normally (moving files, deleting, etc.) it won't last more than 5-10 minutes without a reboot.

PS: glad you had luck with your TCC5.

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Originally Posted by amrgb

It gave errors only at the 20th-30th loop of test5.

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That (with all due respect) is JUST A HEAT ISSUE! ;) And yes... both sticks are SPI stable at about DDR610 (so above what the screens above show). :)

Also with all due respect, it is NOT A HEAT ISSUE. My memories do not exceed 32ºC in memtest #5 loop even after an hour, with an ambient temperature of 27ºC. I have a DFI Nf4 and a XP-120. The lower stick is cooled by a Delta 190CFM on top of XP120 and the upper one is cooled by a dedicated 5000rpm 70CFM 80mm fan. If this is heat issues maybe I'll have to consider moving to Alaska :D Also, I've tried vdimm from 2.6v to 3.0v.

I entirelly trust the temp probe, moreover sticks were cold, not even warm. However, when I sent the sticks to RMA, i noticed that the heatspreader was already not making good contact with the chips at the stick endings. If it was a heat issue, then it was caused by the heatspreader (they can do more harm if something goes wrong than good if everything is ok).

Quote:

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Originally Posted by varzmaster

It's not necessary to remove the heatspreaders (aka voiding warranty :D)... just read the rev on the label carefuly. ;) If it's 4.1, they're TCCD's. If they're 1.4, they're UTTs. That simple.

It is possible that for the 4.1 rev, Corsair may have used other Samsung ICs (like TCC5)... which may be a good thing. I got DDR606 2.5-4-3-8 1T on A64 (Abit AN8) and DDR566 (283 MHz) 2.5-3-3-5 (with PAT) on Intel (Abit IC7). Those TCC5s are used in rev 4.3 of the Corsair 3200C2(PT). :)

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i am sure it is rev1.4, see this

no more comment from u guys??

im testing this version 1.4 RAM (2x512MB),
last time can boot up with CL2.5 or CL3,
now only able run with CL2 ~!!!
CL2.5 or CL3 cannot go into window,
hang at the verify DMI BIOS sceen there...

what's the problem ? :(

2-2-2-5 1T, 2.9v can go up to 210MHz,
priming now ...
result tomorrow morning.