Why not simply call it TRUE rev. D. The only chance they've got is if they used ultra hitech materials or some very special heatpipes. But knowing TR and how they like to rebrand every product without improving it this will probably be the same.
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Why not simply call it TRUE rev. D. The only chance they've got is if they used ultra hitech materials or some very special heatpipes. But knowing TR and how they like to rebrand every product without improving it this will probably be the same.
looking forward to it, hope the price is good.
thats it...? 1 more heatpipe???
does thermalright still have any engineers working in their labs or what? :P
is there anything else to do?
Since the TRUE has the same number of heatpipes but arranged differently they didn't go through so much trouble. What to expect from a company who's best engineers left and formed a new company.
no, all heatsink engineers should be fired and all heatsinks should be based on the TRUE from now on...Quote:
Originally Posted by jmke
is there a need for a better air cooler? a decent one can keep a pretty beefy cpu cool with a very slow fan. and since theres no 250W TDP chips coming out for a desktop, whats the point of worrying about making a heatsink that can do very well, but fit in only a few cases, and only be sold to people who dont plan on WCing. it would probably be too expensive to design/make, and not sell enough of them since it would be a niche market.
i do believe air cooling is pretty much done until we see a new standard for socket designs that can offer something which brings a large jump in possibilities.
http://www.xtremesystems.org/forums/...1&d=1260330452
vs
http://www.fudzilla.com/images/stori..._expreview.jpg
i dnt think both r same :D
as u can see the top one has sharp cuts in the fins where as the bottom one shows smooth fins ...
i think either experview posted older pics :D or the other guy posted wrong images :)
Thermalright should rename it GTS 120 EXTREME
Too bad they didn't have the heatpipes come in direct contact with the core.
the top air HS don't have direct contact, it's not really the most efficient dispersion of heat, which is why you see Thermalright never doing it.Quote:
Originally Posted by freeloader
i think it has to do with pressure. since a heatpipe is probably too soft to get real contact, for direct touch blocks, the copper base acts like a frame and absorbs most of the pressure and dramatically reduces the surface area. so the heat limitation is now from the cpu getting to the base. while top end coolers have better heat pull from the cpu to the base, but slightly worse getting from the base to the pipes.Quote:
Originally Posted by LedHed
Here's some more to wet your appetite :D
i remember seeing that cyclone looking thing before, probably not that exact version though
i think they are too big for most applications. good idea. i just dont think we have the socket location ready for such things.
http://www.xtremesystems.org/forums/...1&d=1260386719
Wow...:eek:
If thats going to become the standard base finish for venemous / ultra120 revD thats going to be amazing.
yup, that was what I said.... :shrug: (and btw TRUE is based off another companies HSF; TR didn't do tower coolers for quite some time)Quote:
Originally Posted by saaya
any way do you see a way to improve surface area, heat dissipation, while keeping in line with size and weight and price restrictions? we're running out of variations quite quickly; we've had the major HSF upgrades, none from the last 3-4 years have really stood out, major game changers so far:
- Going from alu to copper
- Adding Heatpipes to copper
- Tower coolers
.... all they've done now since the first tower coolers were introduced is add heatpipes and slightly tweak layout/fin size/amount. But a major step with current materials I'm not expecting. and with the size of the base being the decisive factor for adding heat pipes, you can only fit "so many" in that square... layered heatpipes don't have quite the same effect...
the only other semi-practical change is to go direct touch
for big loads it isn't though, the base layer acts as a buffer for higher capacity.Quote:
Originally Posted by DragoonXX
I've seen the Hyper 212+ beat the TRUE and it uses direct contact. :shrug:Quote:
Originally Posted by LedHed
http://www.hardwarecanucks.com/forum...review-12.html
one quick google and i found thisQuote:
Originally Posted by freeloader
http://www.anandtech.com/casecooling...spx?i=3141&p=6
i would like to see a real test done to compare direct touch heatpipes with bases. id also like to see someone shave down the base of a true until the heaptpipes are exposed and see what happens (just for the fun and curiosity)
No direct heatpipe contact coolers as long as I have IHS off :D
i ended up denting my waterblock doing that. and it wasnt a small dent, the entire area where the chip was ended up about 1-2mm pushed in. after hours of sanding i got most of it fixed. fixed my temps by about 15CQuote:
Originally Posted by Behemot
all cooper
several things were mentioned in this thread already. direct touch of the heatpipes to the base, more, thinner heatpipes, vaporchamber at the base, improved fin profile, drum shape plus vga type fan... they dont even seem to TRY... nobody seems to...Quote:
Originally Posted by jmke
Quote:
Originally Posted by saaya
- direct touch of the heatpipes to the base: as pointed out, doesn't necessarily improve performance
- more, thinner heatpipes: thinner = less heat that can be removed per heatpipe
- vaporchamber at the base: expensive?
- improved fin profile: I think we've maxed out surface area with those
- drum shape plus vga type fan: classic fan offers superior performance/noise ratio;
- Xigmatek Thor has thin heatpipes & direct touch, amongst othersQuote:
Originally Posted by saaya
- plenty of custom size/design HSF with integrated fans, they fail horribly in performance/noise rank
:shrug: