New Ultra 120 xtreme something amiss...

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Originally Posted by LuckyNV

when I remounted, the paste was evenly spread, obviously if one puts too much it may squish out the sides. I just put a blob in the middle, most likely my accidental twisting while mounting another fan spread out the paste. My IHS is slightly concave though

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I spread a thin layer of MX-1 on mine so even if it slides pastes is not going to be an issue

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Originally Posted by nealh

My cpu L47G was under water first as a test of temps...well within expected from L628A66 temps....no odd ball temp spikes, or one core 10C higher than another...and I pushed more vcore and speed

The case has 120mm intake, 120mm exhaust..a 7300gt, passive cooled, one hdd and ODD, 2 x 1gb ram...nothing else

I am sorry I could buy another cause but I specifically tested quickly on my watercooling setup for this reason

I can not promise my IHS is not slightly concave but nothing significant for sure..I would have seen temp issues on my water setup


The TR Ultra 120 E....when mounted you have to get the 4 screws in place and it takes a fair bit of pressure to get the last 3 screws to engage with the mounting bracket and they are as tightly screwed down as possible...

the HS moves IMHO way to much laterally...what other high end HS ever did this

My hetapipes and base are not getting warm at all...there seems to be little to no heat transfer

If you look at the installation instruction..the X bracket goes below the mobo for support, place the HS on chip, place anothe Xbracket on the HS base and screw in 4 spring loaded screws..tighten and done

What am I missing?

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You sure you applied the paste correctly. You need to put a blob of MX1 thats double the size of AS5 in the middle and let the pressure spread it. Trust me, even though the heatsink turns, it has more than ample pressure to spread it thinly. By you spreading a thin layer, if either IHS or the base of teh TR is concaved, you just bought yourself a pocket of air.

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Originally Posted by situman

You sure you applied the paste correctly. You need to put a blob of MX1 thats double the size of AS5 in the middle and let the pressure spread it. Trust me, even though the heatsink turns, it has more than ample pressure to spread it thinly. By you spreading a thin layer, if either IHS or the base of teh TR is concaved, you just bought yourself a pocket of air.

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Is MX1, is that the tube that comes with the HS? Wouldnt the AS5 be better to use? Sorry, I just ordered mine so I am kind of asking alot of questions before i install mine :up:

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Originally Posted by P§I

Is MX1, is that the tube that comes with the HS? Wouldnt the AS5 be better to use? Sorry, I just ordered mine so I am kind of asking alot of questions before i install mine :up:

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MX-1 is supposedly better thermal past vs AS5

Situman...I thought about this..but a good HS should be flat and by adding a big blob to fill a concave HS..I doubt heat transfer would be good...most reports are too much TIM makes for poor heat transfer..but maybe it is appled wrong and I will redo it..but I doubt that will make a 5-10C difference which is what I would need to get reasonable temps

trust me, the excess will get squished out the side. just use double the amount of as5. if it doesnt pan out, go back to as5. It also depends on the chip you have. My 28B chip runs hot as hell, sometimes I wonder if its actually soldered correctly to the die itself.

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Originally Posted by P§I

Ok if alot of people saying that the mounting bracket is a defective design well TR make a better one? Will they swap it you think? Or do you think they will ignore the problem?

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Anandtech suggested they make bends at the corners to prevent the HS from moving, or redesign the clips. The non-extreme model has a bracket that secures the HS snugly and prevents any movement because the corners lock the HS in place.

1) Would there a difference if the Thermalright was upright instead of horizontal in a vertical case, or does the direction of gravity have absolutely no bearing on heat pipe function? If anyone here cares to try and see if there is a difference...

2) The tests I saw showed much bigger improvement when CFM was high... if you are using 30ish CFM you should try it with something closer to 100.

[1] no diff, there is already a thread showing diff in temps between the two positions

I had a look at the revised clips and there is 1 big problem with them, namely that as they now have a scissor action one metal strap is above the other therefore only 1 strap grips the base of the heatsink, the other even though it's locked in place by the screws is above the base plate. This allows the heatsink to be rotated when mounted, I'd suspect that the problem would be even worse when installed in an upright tower case.

What you could try is shimming out the gap left with a metal pad on either side to get a nice secure fit but success of this would depend on how strong the metal used for the mounting is really.

srry bout that, not getting back with my lapping results n all...

before lapping running my 29b @3.6GHZ took 1.5v and with this HSF resulted in approx 68c top end orthos....

after lapping with the same settings results in a max of 55c orthos load.

I reseated the thing a few times before lapping, seems to have helped a bit, also it's just a HOT chip...

would TR 120 bracket fit the TR 120 EX? Apparently not since Anandtech told so, but I'm still tempted to buy one from jab-tech