Intel changes LGA775 package for Kentsfield...

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Originally Posted by VictorWang

FCG, you can compare with 965XE, same PCB as kentsfield there ;)

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Yes, I realized that aswell today.
The additional layers could be for the FSB interconnects between the two cores.

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Originally Posted by PGHammer

AMD will have to re-jigger K8L to be socket-compatible with AM2 (which it isn't planned to be for now), so as to avoid pissed AMD users deserting in droves (two socket changes in a year is a bit much to swallow, and is something that even Intel never tried to do) which will, naturally, result in more delays, which gives Intel a greater incentive to utterly *swamp* AMD in Core product (Solo, Duo, Core 2 Duo, and Kentsfield/Core 2 Quad). If Kentsfield yields are low, however, AMD would be correct to be screaming *paper launch*; internally, AMD's board will be realizing that they dodged a major bullet.

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No K8L is scheduled to be backwards compatible with AM2 (DDR2 memory), but will launch at the same time as AM3 (DDR3 memory)

the added thickness of the PCB upon which that specific proc is built should not have any effect on the LGA775 socket nor any LGA775 heatsink by the looks of it.

the lga type socket is partially designed for expandibility, the pins are very spring like and are designed to be compressed, which have an envelope that can be worked with. also i think the IHS can be trimmed a wee bit to be within spec for the increased package. no new socket :|

this is finally my first post! after i registered like 2 weeks ago i never got a confirmation email but i guess one of the mods heard my cry for help a couple days ago. thanks!

as long as it will work on 975x, which you guys say it will
then i see no problem hsf, they all screw down anyways dont they