I doubt it will have the desired effect your looking for splave.
When used as a tim it is soldered directly to core not just placed on. They use concentrated heat and it gets heated melts and cooled extremely fast.
the only way i could see it could be used safely is to solder the IHS to pot then use paste on core but.......back to square 1 when doing that. The entire point is just to eliminate thermal barriers.
That stuff has a preety high melt point. Unsafe if we are talking heating a pot up to solder to core.
Few times I have removed IHS's that use indium it has been enough to desolder pins.......which means the heat required would also be enough to desolder the BGA package.
What you can try is a little blow torch with indium on core place IHS on concentrate heat at center of IHS, have a pot cooled with ln2 ready to place on as soon as you think its melted to bring it back to a safe temp.....still risky though and still sort of defeats the purpose.