That seems highly unlikely consider bulldozer is not at all competitive with sandy bridge.
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On what evidence is everyone in this thread speculating on the high voltage / high temps? I looked through but didn't find links to specific examples.
I'm putting my money where my mouth is by purchasing an i7 3770k on launch day. I believe it'll OC better than snb because of the data Intel shared on tri-gate transistors. Reducing leakage that substantially ought to increase thermal headroom, all else being equal.
Oooooh you don't really want to do that with everyone here :rofl: Unless the retail chips prove to be significantly better than ES samples.
Free chip for joo M.Beier? :D
-PB
Ivy will bring all the (cold) overclocking fun like we used to have with cold friendly cpu from long ago:D
That PC Ice's yellow cascade already buried with its maker:D
This one is new, lighter and won't break my back. Lol
SS for Ivy build by runmc:up:
http://img690.imageshack.us/img690/3...enshot128x.jpg
^And here was I, thinking it will only be good for laptops..
when is ivy supposed to launch? Trinity should launch by may 15, it should be interesting to see the 2 head to head, seeing as how glofo's 32nm process issues have been worked out. i am still wary of intel graphics though, i mean have they gotten better at drivers?
Intel's coming Ivy Bridge processor overclocked to over 7 GHz with liquid nitrogen.
http://www.nordichardware.com/news/7...-nitrogen.html
what makes it clock so well under exotic cooling and supposely not under air or water ? the need for extreme vcpu ?
Probly because its 22nm process of the CPU die....internally the cores not being able to dissipate the heat quick enough with regular air cooling/h2o
What is max turbo multiplier "only" 63x? Why not 64 or 65x?
8 or 16 bit ?
I can totally see Intel putting some 'blank' die space between cores in the future, just to aid the dissipation..
Either that or making transistors work at higher temperatures.
Any new info? Still a dog on Air/Water? Is it possible that the retail CPUs will be better in this regard?
i found i7 3770 (non k :'( ) and 3570k in stock in France (along with 3450 and 3550)...seems weird, but does it means NDA won't stand for long ?
damnit why no 3770K ? :'(
Smaller die area surface to enter in contact with the IHS and so on with the cooler.
I mean SB on 32nm had 216mm^ die size, IB on 22nm has 165-170mm^???.
More tranzistors/mm^ of die, more heat per mm^ but less contact to disipate so in conclusion bad thermic transfer.
Intel to help should make the IHS from a much better conductor material and may be to ensure a much better contact with the die.
May be an copper IHS should help. :up: