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Anyone know wtf is going on? First it was obvious that UTT was using former Winbond casings which had 2 dots. But now you can find UTT with 1 dot, 2 dots and even no dots....all of it is the same ICs :stick:
Anyone care to explain wtf is going on?
Example:
http://www.ocforums.com/showpost.php...30&postcount=4
I'm not sure but didn't OCZ admit they use UTT on VX. The IC's on VX don't have the Winbond-dimples (As far as I know).
the ocz VX is built to thier specs, so while it uses the UTT die, they cant package it anyway they want, maybe they have it packaged to handle more volts/heat?
they only company without dimples that ive seen with UTT is OCZ, so i just assume that it is because of thier claim that they are "made to thier specifications"
They have probably just milled the top off of the ceramic on the chips. Ceramic doesn't transfer heat well so by removing it the die can be kept a little cooler.