How should ABIT position the Crossfire motherboard?

[tictac]

Dear All,

ABIT USA now gathering information for our PM team in Taiwan in regards to our future Crossfire platform.

Vote and post your suggestion at this thread:
http://forum.abit-usa.com/showthread.php?s=&threadid=87043

Thank you,
tictac :pimp:

[tictac]

i want Pure Overclockers board :cool:

Overclocking Option
Vcore Option : Default voltage up to 2.0V (at 0.025v increasement)
DDR Voltage : 2.50V up to 4.00V (at 0.05V increasement)
DDR VTT : 1.25V up to 2.00V (at 0.05V increasement)
Chipset Voltage : 1.50V up to 1.80V (at 0.10V increasement)
HT/LDT Voltage : 1.20V up to 1.50V (at 0.10V increasement)
HTT : 200MHz - 500MHz

Memory Timing Option
Dram Timing Low : Function#2 Offset#88h
; CAS Latency
; Row Cycle Time
; Row Refresh Cycle Time
; RAS to CAS Delay
; RAS to RAS Delay
; Min Ras Active Time
; Row Precharge Time
; Write Recovery time
Dram Timing High : Function#2 Offset#8Ch
; Write to read delay
; Read to write Delay
; Refresh rate
; Write CAS Latency
Dram Configuration low : Function#2 Offset#90h
; Dimm Drive Strength
; Read/Write Qued Bypass
; Bypass Max
Dram Configuration high : Function#2 Offset#94h
; Maximum Async Latency
; Read Preamble
; Idle Cycle Limit
; Dynamic idle cycle counter enable
; 2 additional Memory dividers [150MHz/DDR300] & [183MHz/DDR366]
Dram Delay Line Register : Function#2 Offset#98h
; DQS Slew Value
; DQS Slew Control

Audio (7.1 Channel 24bit High Definition)
; Add on PCI card
; Audio Chip : VIA Vinyl Envy 24HT
; DAC : Wolfson WM8770 24bit 192khz codec with an 8 channel DAC and 2 channel ADC inside
; Caps : Rubycon / Sanyo Oscon

SouthBridge : ULi 1575 (PCI Express 4x connection to NorthBridge)
; 4 x Serial ATA II 3Gb/s (with NCQ Support)
; 2 x ATA-133 with RAID 1, 0, 0+1, 5 , JBOD support
; 8 x USB 2.0
; 1/10/100 Mbps Fast Ethernet

Board Layout as below
http://img151.echo.cx/img151/6091/tictaccrossfire23fx.gif
http://img151.echo.cx/img151/6091/tictaccrossfire23fx.gif

[QuikSilver]

I am not liking those silent OTES/heatpipe coolers. I think those 2 chips should just have regular heatsinks with active cooling. The heatpipe will probably get in the way of big HS's like the XP120. I also think the 4pin power connector should be close to teh 24pin power connector, like on the DFI Nf4 boards, it makes it easier to manage the cables.

EDIT: And maybe active cooling on the MOSFETs, that is something you dont see too often and as overclockers I believe that would be an appealing feature.

[chew*]

I voted for OC options and um told them to REHIRE OSCAR WU :stick:

[fatfreepork]

gonna post there. i like options 2 and 3