Saeid
10-04-2004, 01:11 AM
Ok i'm considering getting a LGA775 CPU with a 865PE Mobo with LGA775 support!
Now im familiar with 478pin P4's (since my current CPU is the 2.4C)!
Was considering the Gigabyte GA-8IPE775 or the MSI 865PE Neo3 both of which support the LGA775 CPU! Still dont know which to get!
Anyways i had a couple of question, that hopefully u guys could answer:
1. In the retail version of the LGA775 CPU, on the bottom of the fan-heatsink is there (on the round copper plate) is there a thermal glue/paste? Just like on the 478 retail heatsinks? On the 478pin heatsinks you would remove this plastic nylon thing from the bottom of the heatsink, and thus revealing the thermal paste (which was square shaped to cover the entire CPU), and once placed on the CPU everything was good to go! Is it the same with the LGA775 Retail Heatsinks?
http://www.ixbt.com/cpu/images/s775-cpu/s775-with-cpu.jpg
2. The bottom of the retail heatsink for the 775, there is a round copper plate (ts odd cause the actual heat sink is made from aluminum!) ;) Anyways i was wondering obviously the heatsink wont cover the entire top area of the CPU, so is this a problem? I mean does it really make a difference if it covered the whole area, or excluded the edges of the CPU (like it does now)?
http://www.ixbt.com/cpu/images/s775-cpu/s775-cooler-bottom.jpg
3. And with the current LGA775's in the market (im considering the 530) what revision are they? And if and when the later LGA775's come out of the same CPU (ie. 530) will there be a performance difference/Heat output/etc? Can please state the main difference that we'll see.
Thnx! :D
P.s. Are the 530J's Stepping E0? And NX-Bit? And what is NX-Bit some kind of 64-bit thing?
Now im familiar with 478pin P4's (since my current CPU is the 2.4C)!
Was considering the Gigabyte GA-8IPE775 or the MSI 865PE Neo3 both of which support the LGA775 CPU! Still dont know which to get!
Anyways i had a couple of question, that hopefully u guys could answer:
1. In the retail version of the LGA775 CPU, on the bottom of the fan-heatsink is there (on the round copper plate) is there a thermal glue/paste? Just like on the 478 retail heatsinks? On the 478pin heatsinks you would remove this plastic nylon thing from the bottom of the heatsink, and thus revealing the thermal paste (which was square shaped to cover the entire CPU), and once placed on the CPU everything was good to go! Is it the same with the LGA775 Retail Heatsinks?
http://www.ixbt.com/cpu/images/s775-cpu/s775-with-cpu.jpg
2. The bottom of the retail heatsink for the 775, there is a round copper plate (ts odd cause the actual heat sink is made from aluminum!) ;) Anyways i was wondering obviously the heatsink wont cover the entire top area of the CPU, so is this a problem? I mean does it really make a difference if it covered the whole area, or excluded the edges of the CPU (like it does now)?
http://www.ixbt.com/cpu/images/s775-cpu/s775-cooler-bottom.jpg
3. And with the current LGA775's in the market (im considering the 530) what revision are they? And if and when the later LGA775's come out of the same CPU (ie. 530) will there be a performance difference/Heat output/etc? Can please state the main difference that we'll see.
Thnx! :D
P.s. Are the 530J's Stepping E0? And NX-Bit? And what is NX-Bit some kind of 64-bit thing?