Blizzy
07-24-2009, 06:01 AM
Has someone used this before ?
Specs___
Product Details:
The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge.
The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.
With a thermal conductivity of 9.24 W / m ° C is a remarkable performer. The thermal paste is suitable for all types of coolers suitable: CPU, GPU, Chipset, voltage transformers, etc. The compound is suitable over a temperature range of -30 to +200 ° C guaranteed. With 5g, the amount per tube is plenty for many applications.
Features:
Specifications:
Thermal Conductivity: 3.8 W/m-K
Thermal Impedence: 0.087 U2/W
Specific Gravity: 2.5
Dielectric Constant A (100Hz): 5.1
Viscosity: No Flowing
Thixotropic Index: 380±10 / 10mm
Operation Temp: -50~240
Silicone Compunds: 50%
Carbon Compounds: 20%
Metal Oxide Compounds: 30%
Content Syringe: 5g
Specs___
Product Details:
The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge.
The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.
With a thermal conductivity of 9.24 W / m ° C is a remarkable performer. The thermal paste is suitable for all types of coolers suitable: CPU, GPU, Chipset, voltage transformers, etc. The compound is suitable over a temperature range of -30 to +200 ° C guaranteed. With 5g, the amount per tube is plenty for many applications.
Features:
Specifications:
Thermal Conductivity: 3.8 W/m-K
Thermal Impedence: 0.087 U2/W
Specific Gravity: 2.5
Dielectric Constant A (100Hz): 5.1
Viscosity: No Flowing
Thixotropic Index: 380±10 / 10mm
Operation Temp: -50~240
Silicone Compunds: 50%
Carbon Compounds: 20%
Metal Oxide Compounds: 30%
Content Syringe: 5g