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DeathEvil
06-22-2005, 01:35 PM
I have DFI ultra-d and I'm about to replace the compound under the chipset (idle was getting 50C). I noticed there is no thermal compund under the chipset, only yellow thermal pad. Should I remove the thermal pad before applying AS5 or leave it.

Please respong ASAP. thanks

mcnbns
06-22-2005, 01:36 PM
YES, definitely remove the thermal pad, but NOT the square foam border thingy around everything. That acts as a shim and helps protect the core from being crushed when crazy people like us remove the chipset cooler. :)

EDIT: Didn't even see the time of your post. Damn that was a quick reply. :p:

DeathEvil
06-22-2005, 01:40 PM
uff thanks man for extremely fast reply. My mobo is removed from the case and now I was just wondering what a hell I should do?:D

once again thanks!!!