SoF
05-15-2005, 02:50 PM
Hi there,
I was testing my Prommi yesterday - display shows -34°C but Board was first -3°C and after pumping up Vcore got up to 20°C and so no prime@2600mhz was possible.
so i turned the screws little bit more to have more pressure on the die...well worked a little but i had the feeling there was not enough contact between evap and die. what is the best way to fill a gap off 1-2mm without loosing much cooling power?
i think temperatures are correct because the board is able to handle subzero in bios (seems to be so)
http://www.casextreme.net/pixx/subzerorunning1_kl.jpg
Greetz SoF
I was testing my Prommi yesterday - display shows -34°C but Board was first -3°C and after pumping up Vcore got up to 20°C and so no prime@2600mhz was possible.
so i turned the screws little bit more to have more pressure on the die...well worked a little but i had the feeling there was not enough contact between evap and die. what is the best way to fill a gap off 1-2mm without loosing much cooling power?
i think temperatures are correct because the board is able to handle subzero in bios (seems to be so)
http://www.casextreme.net/pixx/subzerorunning1_kl.jpg
Greetz SoF