Ever wondered how it looks underneat the mem chips?

[roger_h99.nor]

I'm probably not the first, nor the last to do this (card was [R.I.P] a Club 3D x800xt)
http://www.home.no/rogerh99/IMG_3671.jpg
And this guy is found guilty as charged:
http://www.home.no/rogerh99/IMG_3672.jpg

See it as a warning, the chips does not stick very hard to the pcb.

My comfort is that it was a lousy OC, sad I didn't got to voltmod it though..

[Nosfer@tu]

Dammm, that sad :(

You should have put it in a bag, closed it tigthly and then throw the card in the freezer. It cribels the glue. and makes it easy to geet the profile off.

had a friend that wanted to se how strong the termal glue from work was.

This happend :nono:

[roger_h99.nor]

I Did actually freeze it, didn't make any change ar all.

I use 50% AS5 and 50% AS Thermal Adhesive, so I imagined it would come
fairly easy off..i was wrong.

[Nosfer@tu]

AS Thermal Adhesive is a bad thing if You plan to take it off later :p

But I gees You knew

[runmc]

Can you take a picture of the backside of the memory chip itself and post it? :D

[Holst]

I did the same thing to an old P3 after sticking a heatsink to it using AS adhesive.

[demonR6]

*mental note to self.. do not use adhesive to stick surfaces I later want to unstick.

[roger_h99.nor]

For your veiwing pleasur (backside of memchip):
http://www.home.no/rogerh99/mem_back.jpg
The darker area is casued by me; wanted to have a look inside the chip :para:

I dont belive every 'dot' on the chip is connected to the PCB, only those who are standing a bit up, but I realy don't know.

[runmc]

Sorry about that bro :(

[uwackme]

First, you DO NOT use AS3/AS5 around BallGridArray chips. If any of the conductive compound gets under the edge of the chip you're screwed.

Second, use AS3 Ceramique, and mix it 2-4 parts Ceramique, 1 part AS Alumina epoxy "A", and 1 part AS Alumina epoxy "B". This gives you a good grip that WILL come apart if you need it to, yet stick well and give good heat transfer.

The strong "dilution" using the AS Ceramique will keep you safe, while maintaining heat transfer. Further, it is all NON-conductive so a slip or blob around the lip of the BGA wont spell disaster.

Do this on ALL applications except CPU/GPU cores and you wont ever have issues.

[Muk]

when i used 50% alumina adhesive and 50% as5 for my mem sink on the gfx card, they fell off with jolts when i was moving my case. I had to reglue them on using a higher percentage of Alumina adhesive. BTW these are massive copper sinks.

[esdee]

count me in the club... HIS x850xt too bad it was right before we benched (the ATI tool s temp indicator got 0ed so < -50) the card did un-volt modded 650/650 EASILY

http://img.photobucket.com/albums/v503/eedse/death-card.jpg



seems like they don't make them like they used to :D

[DeltZ]

rofl!

IT CAN BE REUSED! :banana:

[FireDragon]

Yeah I know what that feels like...it kinda sucks...I had one of the best stock 9800pros IN THE WORLD never sawa nother 9800pro clock like that one did even vmodded cards on water...it mad me sad...

Dragon

[mike]

Sorry for your card!
dang - I am trying to get my AS adhesive off as well - now I guess I shouldn't even try...

[roger_h99.nor]

In retrospect I should have tried to force a razor-blade between the ramsink and memchip. I did this (after ripping the chip off the pcb) and they came apart quit easily.

[speedstream5621]

when i used 50% alumina adhesive and 50% as5 for my mem sink on the gfx card, they fell off with jolts when i was moving my case. I had to reglue them on using a higher percentage of Alumina adhesive. BTW these are massive copper sinks.
Yeah, I don't think those two compounds are supposed to be mixed. That, or you didn't mix them thoroughly.

Roger, the 50/50 mix is the standard mix. You needed to use half as much of the epoxy to have a chance.