View Full Version : Ultra-D chipset fan... should I remove the "pad" stuff
CHaynes112
04-09-2005, 05:38 AM
I am getting ready to remove the factory paste and apply AS5. I am also going to remove the top cover of the assembly. I was just wondering it I should remove the "pad" looking stuff that is around the factory paste? What is it's purpose... to cool, or just to stabilize?
-Thanks
$0m#0n#
04-09-2005, 05:39 AM
no leave the pad.
Minstadave
04-09-2005, 05:39 AM
Its a foam shim, to keep the chipset cooler level I believe.
CHaynes112
04-09-2005, 05:50 AM
alright, thanks
Unrealcpu
04-09-2005, 05:55 AM
Thats funny i just did a thread on this and i had 11 replies telling me to remove the pads and add arctic creamique
Thats funny i just did a thread on this and i had 11 replies telling me to remove the pads and add arctic creamique
There is the thermal pad, and then there is a foam pad around the the bottom of the hsf. Leave the foam pad.
Unrealcpu
04-09-2005, 06:01 AM
There is the thermal pad, and then there is a foam pad around the the bottom of the hsf. Leave the foam pad.
i know there is pads but to cool the chip it uses some kinda of arctic silver stuff.
Are you saying there is a pad for the chip too?
Always
04-09-2005, 06:04 AM
It has the same function as the 9800pro shims I believe. However, let's wait for someone who actually owns the board and can tell us his experience with removing the pad
Let me rephrase.
There is a thermal pad which you will replace with some thermal paste. Then there is a square foam shim on the bottom of the heatsink that stabilizes/spaces it. Leave the foam shim on the heatsink.
I removed everything and use as5 and my chipset temp doesnt go over 46c
CHaynes112
04-09-2005, 01:14 PM
With stock fan and stock paste, my chipset never goes above 44 degrees... That is with the fan set to run at Full at 55 degrees. I also have an X850 XT PE above the chipset fan. I only saw 45 degrees once I upped the voltage to 1.8V. My case does have GREAT airflow though. After I apply AS5 and remove the top elipse thing, I will report back with my results.
BTW, I am using a Lian-Li PC-60 Plus case.
-LaTeR
texuspete00
04-09-2005, 01:19 PM
We're all right. A shim like in most other cases is optional. One thing at issue here though is the craptastic yellow pad they used as a TIM on the actual chip. That could actually be thick for the purpose of, together with the shim, fill a gap. You can just remove the shim if you are confident in not crushing the core or simply check for contact with plain old paste and shim.
I'd just take all that crap off but if you like the idea of a shim just check for contact.
Minstadave
04-09-2005, 02:07 PM
I removed everything and use as5 and my chipset temp doesnt go over 46c
Using this:
http://img194.exs.cx/img194/381/zalman6bw.jpg
My temps don't go over 32-34 load :D :toast:
HARDCORECLOCKER
04-09-2005, 02:16 PM
I am getting ready to remove the factory paste and apply AS5. I am also going to remove the top cover of the assembly. I was just wondering it I should remove the "pad" looking stuff that is around the factory paste? What is it's purpose... to cool, or just to stabilize?
-Thanks
:D Don't remove the pad - replace the whole cooler. Thin cheap material, better go for heavy pure copper like this here:
<img src="http://img144.exs.cx/img144/7990/cuv2rhsb2ek.jpg" alt="Image Hosted by ImageShack.us" />
Made good experiences with it, used it for GPU, NB, SB and the fan only for MOSFET cooling.
:toast:
id think that would touch my xt, i had to sand the side of mine so it misses by 1mm :)
[XC] 4X4N
04-09-2005, 03:29 PM
Using this:
http://img194.exs.cx/img194/381/zalman6bw.jpg
My temps don't go over 32-34 load :D :toast:
I like that :D Would like to get rid of that fan, it's the loudest one. When I removed the stock thermal pad, I tried to save the foam shim, but no luck. Replaced it with AS5 and my temps went from 47-48 to 43-44 at load.
does a heatsink like that really cool as good as a fan does(or better)? and what are you using under that heatsink? i might have to buy one and try that out, do you sugest any model/brand i should try?
--- MinstaDave ---
Now that's extreme, but innovative ;)
--- HCC ---
The Titan would just fit, same height as stock. Nice call :)
--- CHaynes ---
Considering that you can short out the top of the chipset if not careful (ask HCC), you should either keep the "foam shim", or make/get some rubber/foam "feet" and put them on the corners of the chipset, like the Athlons had on them to prevent inadvertent shorts ;) (in fact, trimmed old XP feet work well)
CHaynes112
04-09-2005, 08:13 PM
UPDATE
--------
I removed the factory yellow paste (it was VERY hard and dry, and VERY difficult to remove) and applied AS5. I also removed the Elipse piece on top of the fan. I did leave the foam shim in place. My temps have went from 44 degrees to 37 degrees! :banana:
I recommend this to anyone wanting to drop their temps a bit.
-LaTeR
trakslacker
04-09-2005, 08:51 PM
Using this:
http://img194.exs.cx/img194/381/zalman6bw.jpg
My temps don't go over 32-34 load :D :toast:
that is awesome. from the marks on the tips of the fins, it almost looks like you just went at it with a pair of pliers. Am I close? If so, I may just jhave to try this after I get my Ultra-D here in a bit.
Minstadave
04-10-2005, 04:50 AM
does a heatsink like that really cool as good as a fan does(or better)? and what are you using under that heatsink? i might have to buy one and try that out, do you sugest any model/brand i should try?
If you're referring to my zalman sink, with no airflow its approximately the same as the stock cooler (40 idle 44 load) with a quiet 120mm fan blowing over the PWM are its alot better than stock (30 idle 34 load). I'm using AS5 under it. Its a Zalman ZM-NB47J Northbridge Cooler, ideal as its position is adjustable so you can get your GFX card PCB to run through the gap you bend out.
that is awesome. from the marks on the tips of the fins, it almost looks like you just went at it with a pair of pliers. Am I close? If so, I may just jhave to try this after I get my Ultra-D here in a bit.
Yup I took a pair of needle nose pliers to it, after having figured out which pins to ben which way, took about 5 mins to do and is very effective.
i took the foam pad off of mine, well i was forced to- as i lapped the heatsink. before lapping my chipset HSF, chipset temperatures were around 41-45 deg. now the temperature never goes higher than 35 deg on load.
i found that the HSF wobbled after taking the foam pad off but after using some arctic silver its fixed in position :)
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