101
01-02-2004, 02:14 AM
What are your opinions on this? I have no qualms about removing the heat spreader, I've done it on previous P4s, and no the chip I am working with now is not one with the soldered on IHS. However I was concerned after seeing this (http://www.hardocp.com/article.html?art=NDE5) over at hardocp where they managed to get one off presumably though the contraction of the IHS under the reduced temperature or other TCE mismatch issue. I certainly don't want to kill the chip in such a manner, however I'm a little concerned about chiping it with the evaporator should I choose to remove it.
I'm leaning towards removing it and using a shim or some felt pads (done previously) to reduce the likelyhood of cracking the core, but I am curious to know if anyone else has managed to duplicate what they did in popping one off. Any thoughts or experiences anyone can share?
I'm leaning towards removing it and using a shim or some felt pads (done previously) to reduce the likelyhood of cracking the core, but I am curious to know if anyone else has managed to duplicate what they did in popping one off. Any thoughts or experiences anyone can share?