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catkicker
08-26-2007, 02:00 PM
With the lack of choice for TEC blocks for processors. I've been thinking about building my own block. I'm still reading all I can find on TEC cooling.

Current watercooling setup CPU loop
MCP655 pump
1/2" tubing
DD filport/res.
Coolingworks Coolrad 32T - Triple 120mm Radiator
3x120mm panaflos max 86.5CFM

Heres the block I wanted to use
http://www.swiftnets.com/products/Apogee.asp
The block base is basically 50mm x 50mm

I was going to use a 50mm x50mm with a thickness of 3/8" copper

I wanted to use this peltier
http://www.frozencpu.com/products/2411/exp-04/437W_Qmax_Peltier.html?tl=g30c105s187
Imax: 32.8 Amps
Qmax: 437.2 Watts
Vmax: 26.7 Volts
Delta Tmax: 74.4 (K)
Size: 62mm X 62mm X 3.55mm

A few questions.
this peltiers dimensions are larger then the apogee water block. Could I just make the cold plate the same dimensions as the peltier Or do I need to find a bigger block?
I have a old swiftech 6002 block. I would have to probably drill the block so that the cold plate and peltier could be mounted.

right now I have a DC opteron. Eventually I will upgrade to intel core duo or maybe quad. Will the 437watt. peltier provide adequate cooling for the eventual upgrade.

Clamping question.
I saw this statment and wondered just how true this is.
"There is another factor that must be dealt with when using a cold plate (with TECs) and that is the 10 fold difference in recommended clamping force between the CPU and the TEC. Typical TEC manufacturer assembly recommendations call for 150 to 300 pounds of clamping pressure, while AMD's CPUs are between 12 and 24 pounds (AMD doc # 23794B).

A common reason for poor cold plate/TEC performance is insufficient clamping pressure. A separate, much stronger, clamping system is required for TECs than that used to restrain the assembly to the CPU. For Socket applications, this can be a bit of a challenge."

Any suggestions or tips would be appreciated.

Alik4041
08-28-2007, 02:34 AM
WOW with a 437w peltier, I definitely wanna see how this turns out :D
/subscribed and Good luck:up:

naPS
08-28-2007, 08:09 AM
Clamping question.
I saw this statment and wondered just how true this is.
[B]"There is another factor that must be dealt with when using a cold plate (with TECs) and that is the 10 fold difference in recommended clamping force between the CPU and the TEC. Typical TEC manufacturer assembly recommendations call for 150 to 300 pounds of clamping pressure, while AMD's CPUs are between 12 and 24 pounds (AMD doc # 23794B).

Okay - first post in here, but I think I'll be able to help you out.

Yes, you will need a cold plate that covers the entire peltier. You will also need a hot plate that covers the entire peltier as well, or else you are just going to cook the thing. If you don't remove the heat from the hot side of the peltier, it will bleed over onto the cold side, and the whole unit will keep getting hotter and hotter until it basically burns out.

Not really sure how you are going to generate 300 pounds of clamping pressure on a CPU without breaking the motherboard. Call me crazy, but I'm pretty sure this quote is FUD.

If you need large clamping pressures on the peltier, that's where the design of the block comes in. You can generate some large compression pressures between the cold plate and hot plate (with the peltier in the middle) if the block is beefy enough to handle it and it is designed correctly.

You should check out the Wintsch Labs Arctic Web - it's back on the market, and is really the only mass-produced block that is built specific for the 437 watt peltier.

You can find the Wintsch Labs block at http://www.wintschlabs.com and they can now be bought at his on-line store at http://www.arcticspider.com