TEC assistance requested

[despat]

I am in the process of TEC watercooling my Evga 680i board with an E6700 and and normal watercooling the 8800 GTX. I've managed to get everying thing inside the HTPC (believe it on not). The meanwell will sit on the PSU and will have a blowhole with 80mm fan on top of the case. The only things sticking out is the 2x120mm Rad on top and the other 120 fans/rad assembly on the back.

I currently got the following:

Lian Li PC-V880 HTPC Case
MCW60 block for the 8880GTX
3 packs of swiftech RAMsinks
1 pack Pure copper NightHawk Ramsinks
MCW5002-T755 block for the Conroe (with the conformal coating and Di-electric Grease and neoprene)
Meanwell 320W with RELAY switch
Xtreme Blackice (2 x 120mm) rad
Swiftechs single 120mm rad
3 X 120mm Enlobal magnetic Bearing low CFM fans (super quiet fans)
MCW1000 Swiftech reservoir
2 X DDC 12v Swiftech (without top)
T-type Thermal Temp Indicator
EVGA Southbridge cooler (mini fan)
EC-VC-RA Copper vga cooler (for NB)

Below is I'm only in the MCW5002-T755 testing phase. I've got a loop with 2 rad (2x120 and 1x120 with 6 fans in all). The inline temp probe reads 35.0 to 35.4 Celcius coming from the block. This is while running running the TEC alone (not installed on CPU). Are these good enough temps to go ahead an install on the CPU. Ofcourse myE6700 will probably add another 10 degrees to that. btw, i've got my Meanwell set to 13.2 V (highest it can go).

A few question below:

1) Perhaps reducing to 8-9 V would be more efficient?? What do you say?

http://208.109.69.149/Dell/tec%20water/IMAGE_00337.jpg


Here's the HTPC with the plexy glass top. You can see the 2x120 Rad on the top with 4 fans.

http://208.109.69.149/Dell/tec%20water/IMAGE_00335.jpg


This pic shows the back with the 120 rad with 2 fans


http://208.109.69.149/Dell/tec%20water/IMAGE_00336.jpg


Anyway after testing the TEC outside a systemand then installing it in the system I pressed the ON button to get 2 dashes on the Code panel of the MOBO. I pulled of the TEC and put a normal fan to see it was a CPU pin contact prob and no change. Then I reset the CMOS after removing all the cards (VGA and MEM) plus the battery. It worked fine. Also noticed that in the process of installing the TEC I lost the 2 pin connector that goes on CMOS pins. Not sure if that's what caused the dashes but it sure sucks to have to redo the whole insulating with the neoprene and silicone.

Anyway, gave me a chance to see how well I insulated things. I noticed that ripping the TEC off was really hard even though the silicone had partially cured. Also, there was a stench of vinigar coning from the acetic acid that let of from the curing silicone. I'm not sure it thats good or not but I want to change the silicone.

2) Can anyone suggest a good brand of silcone to use. I've also tried aquaseal and it sort of permanently glues things up. Any good suggestions as I'm in Canada and I don't think RTV is available. I do have some clear shoe goo (contains perchloroetheylene; which is good suicide poison but I'm not sure how well it's for sealing the TEC.

3) Also can I skip the silcone and just used dielectric grease ( I got luberex) between the neoprene and in the cavity around the core. Can there be any air space around the core or does it all have to be filled up?

4) On the LGA755 insulating with neoprene, I noticed that I've still got a lot of space where air can be trapped around the core and block. Can this area be filled up with dialectric grease or must I use silcone. I'm afraid the luberex might mix up with the conducting paste on the core.

5) what can I use besides AS5 on the core. I've got a little tube of whitish -grey stuff that came with my evercool VGA cooler that I'm using on the NB. Can I use that? And how much should I apply. Does it have to be a thin layer like AS5 or can I generously fill up the cavity with a .5 mm thick layer?

thanks in advance for your assistance!!

[littleowl]

#1 I would say it will not help very muck! but your temps are not good at all for open air block!

#2 RTV is more and likely sold there in canada just go to the autoparts store. and get gasket sealer.

#3 I would suggest it be filled up but it is not super important.

#4 are you talking from the die to the water block or from the heat spreader to the the cold plate? electric tape is what I used on a naked 3200amd.

#5 I use this (http://images.google.com/imgres?imgurl=http://www.dansdata.com/images/coolercomp/ceramique560.jpg&imgrefurl=http://www.dansdata.com/ascer_ttv11.htm&h=380&w=560&sz=18&hl=en&start=12&um=1&tbnid=SyAje2Ub19_ZnM:&tbnh=90&tbnw=133&prev=/images%3Fq%3Dceramique%26svnum%3D10%26um%3D1%26hl% 3Den%26rlz%3D1B2GGFB_enUS227US228%26sa%3DN) and only that. I AS5 is too gummy and will not old sub temps. never put it too thick either. just one drop in the middle and sped it around using the heat sink by pressing it on and taking it back off.

I hope this helps some
but IMO your just kind of wasting your time. A core 2 duo runs to hot for tec and there for kills tec use. you will not get any decent OC with a tec. you will more and likely get better results with just plain old water.

[naPS]

Okay - first off, regarding insulation - you don't have to make sure there isn't an air gap around your block, you only have to make sure that air does not circulate around your block. If you have a relatively air-tight seal around your block, it is okay to have a minor air gap between in inside of the insulation and your block.

Yes, the LGA775 socket is difficult to insulate. I would recommend against putting anything around it that hardens permanently. It will make changing anything incredibly difficult.

Sheets of neoprene sandwiched together works great for insualting blocks. Neoprene is easy to cut, and forms a great seal when applied properly.

If you really feel like you must seal the space, I would use dielectric grease, as it does not harden permanently, and you can make changes to it should you have problems. But, if you just make sure you eliminate air circulation, you should be fine.

And littleowl is absolutely right - you should use Ceramique on the cold side, and AS5 on the hot side. That's what they're designed for. You'll be happy you did.

[littleowl]

tecs and AS5 don't work to gether very well.

[[XC] mysticmerlin]

Okay - first off, regarding insulation - you don't have to make sure there isn't an air gap around your block, you only have to make sure that air does not circulate around your block. If you have a relatively air-tight seal around your block, it is okay to have a minor air gap between in inside of the insulation and your block.

:shocked: Can you demonstrate that for us on your own box first? :shakes:

You have to have an air tight seal on anything that will get colder then the dew point period or you will have condinsation.

[naPS]

mysticmerlin;2397525']:shocked: Can you demonstrate that for us on your own box first? :shakes:

You have to have an air tight seal on anything that will get colder then the dew point period or you will have condinsation.

I actually do have it this way on my own box. You didn't understand what I said... you CAN have a gap, as long as air doesn't circulate. So, yes, you would have to have an air-tight seal, but there can be a gap between the insulating material and the block.

This is also fairly common in industrial insulating applications, for pumps and valves, there is usually a "doghouse" built around the pump to prevent condensation. The insulation doesn't actually touch the pump, it just prevents air circulation...

[naPS]

tecs and AS5 don't work to gether very well.

The hot side of a TEC and AS5 works very well... you definitely don't want to use AS5 on the cold side.

[m411b]

With all seriousness, What would one use on the cold side of the cold plate? AND, Is it necessary to use a cold plate? I ask because I just purchased an AMD X2 6400+ and I want to OC it till it pins fall off. I'm new to TEC so I don't know, I am guessing Arctic Ceramic would work good considering it works very well with Phase.. ??

[littleowl]

I actually do have it this way on my own box. You didn't understand what I said... you CAN have a gap, as long as air doesn't circulate. So, yes, you would have to have an air-tight seal, but there can be a gap between the insulating material and the block.

This is also fairly common in industrial insulating applications, for pumps and valves, there is usually a "doghouse" built around the pump to prevent condensation. The insulation doesn't actually touch the pump, it just prevents air circulation...

I would like to see pics of this myself! If there is a small hole you will still get some air flow moving in and out of the hole

The hot side of a TEC and AS5 works very well... you definitely don't want to use AS5 on the cold side.

yes you can use as5 but Céramique works much better! and is good for both sides so less to think about.

M411b;2400575']With all seriousness, What would one use on the cold side of the cold plate? AND, Is it necessary to use a cold plate? I ask because I just purchased an AMD X2 6400+ and I want to OC it till it pins fall off. I'm new to TEC so I don't know, I am guessing Arctic Ceramic would work good considering it works very well with Phase.. ??

M411b on all 3 tec systems I have done I use Artic Céramique and all most all the same properties in phase apply to tec

[naPS]

I would like to see pics of this myself! If there is a small hole you will still get some air flow moving in and out of the hole

Okay, okay, okay... please read what I typed. We are saying the same thing. YES, you can have a gap between the insulation and the cold components, *BUT* there can be no air circulation in that gap. If the insulation around the gap is air tight, you will not get condensation.

So, there can be space between the insulation and the cold components. But, the insulation has to provide a vapor barrier - it has to be air tight as to not allow air to circulate in the gap. Do this, and you won't have any condensation.



And, you are correct, for applications with a TEC, the difference between ceramique and AS5 on the hot plate is minimal. Not enough to really break a sweat over.

[littleowl]

like I said in the insulation you can not have a gap because a pin hole will let air move in and cause condensation. you said there can be a gap in the insulation and it will not condensate that is very wrong.