View Full Version : IBM goes vertical
nn_step
04-12-2007, 01:06 PM
http://arstechnica.com/news.ars/post/20070412-ibm-goes-vertical-with-chip-interconnects.html
It appears that the first TSV products from IBM will come from the company's 65nm fab and will marry an SRAM to a processor.
Let the stacked cache wars begin :banana:
xlink
04-12-2007, 01:19 PM
heh
i'm just waiting for the time when we can have 1GB l2 cache...
awdrifter
04-12-2007, 01:34 PM
heh
i'm just waiting for the time when we can have 1GB l2 cache...
That would be nice.
G.Foyle
04-12-2007, 01:49 PM
aargh, they stole my idea :D i thought about it 2 years ago, really. And won't heat from downmost layers be an issue?
Vapor
04-12-2007, 01:50 PM
Goodbye software RAMDrives....hello CacheDrives!
-Acid-
04-12-2007, 05:23 PM
THE SPEED WOULD BE BRUTAL
being able to install your os onto the processors cache, run software of it ect
nn_step
04-12-2007, 05:31 PM
THE SPEED WOULD BE BRUTAL
being able to install your os onto the processors cache, run software of it ect
umm you could do that since the IBM PowerPC 750 (just not windows)
SnipingWaste
04-12-2007, 06:02 PM
This is old tech. I know of a few company's that have been doing this for over 5 years in there main fabs and in all there IC produced.
Order
04-12-2007, 06:21 PM
This is old tech. I know of a few company's that have been doing this for over 5 years in there main fabs and in all there IC produced.
With processors that are as sophisticated as POWER?
Its not about stacking, read first then post?
http://news.com.com/Intel+to+unveil+new+way+to+connect+chips/2100-1006_3-5596264.html
Edit: Its not about SIMPLE stacking would be more correct maybe =)
freeloader
04-12-2007, 06:31 PM
Cyberdine Systems anyone? :)